Photomask and methods for manufacturing and correcting photomask

• US 10,394,118 B2
• Filed: 07/12/2018
• Issued: 08/27/2019
• Est. Priority Date: 02/16/2009
• Status: Active Grant

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: Dai Nippon Printing Company Limited
• Inventors: Nagai, Takaharu, Mohri, Hiroshi, Morikawa, Yasutaka, Hayano, Katsuya
• Primary Examiner(s): Young, Christopher G
• Application Number:
  US16/033,596
• Publication Number:
  US 20180321582A1
• Time in Patent Office: 411 Days
• Field of Search: 430 5
• CPC Class Codes: G03F 1/28 with three or more diverse phases on the same PSM; Preparation thereof
• CPC Class Codes: G03F 1/30 Alternating PSM, e.g. Levenson-Shibuya PSM; Preparation thereof
• CPC Class Codes: G03F 1/32 Attenuating PSM [att-PSM], e.g. halftone PSM or PSM having semi-transparent phase shift portion,; Preparation thereof
• CPC Class Codes: G03F 1/36 Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
• CPC Class Codes: G03F 1/38 Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
• CPC Class Codes: G03F 1/44 Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
• CPC Class Codes: G03F 1/68 Preparation processes not covered by groups G03F1/20 - G03F1/50
• CPC Class Codes: G03F 1/72 Repair or correction of mask defects
• CPC Class Codes: G03F 1/80 Etching

Abstract

The present invention provides a halftone mask comprising an assist pattern and a manufacturing method of the halftone mask, which uses an ArF excimer laser as an exposing source, is used for a projection exposure by an off axis illumination, does not resolve the assist pattern while keeping the focal depth magnification effect as the assist pattern, and may form a transferred image having high contrast of a main pattern. A photomask is a photomask comprising the main pattern which is transferred to a transfer-target surface by the projection exposure and the assist pattern which is formed nearby the main pattern and not transferred, characterized in that the main pattern and the assist pattern are each constituted from a semi-transparent film made of the same material, a retardation of 180° is generated between the light transmitting through the main pattern and the light transmitting through a transparent region of a transparent substrate, and a predetermined retardation within the scope of 70° to 115° is generated between the light transmitting through the assist pattern and the light transmitting through the transparent region of the transparent substrate.

Claims

1. A photomask using an ArF excimer laser as an exposing source, being used for a projection exposure by an off axis illumination, and comprising on a principal plane of a transparent substrate a main pattern transferred to a transfer-target surface by the projection exposure and an assist pattern formed nearby the main pattern and not transferred to the transfer-target surface;

wherein the main pattern and the assist pattern are each constituted from a semi-transparent film made of a same material; and

a retardation of 180°

is generated between a light transmitting through the main pattern and a light transmitting through a transparent region of the transparent substrate, and a predetermined retardation within a scope of 70°

to 115°

is generated between a light transmitting through the assist pattern and the light transmitting through the transparent region of the transparent substrate.

2. The photomask according to claim 1, wherein a film thickness of the assist pattern is thinner than a film thickness of the main pattern, and a film thickness difference is a predetermined film thickness difference within a scope of 24 nm to 40 nm.

3. The photomask according to claim 2, wherein the film thickness difference is formed by dry-etching.

4. The photomask according to claim 1, wherein an exposing light transmittance of the assist pattern is a predetermined transmittance within a scope of 15% to 29%.

5. The photomask according to claim 1, wherein the semi-transparent film made of the same material is a single-layer semi-transparent film or a two-layer semi-transparent film.

6. The photomask according to claim 5, wherein the single-layer semi-transparent film is a semi-transparent film made of a molybdenum silicide-based material, and the two-layer semi-transparent film is such that a semi-transparent film made of a chromium-based material and a semi-transparent film made of a molybdenum silicide-based material are sequentially provided on the transparent substrate.

7. The photomask according to claim 1, wherein a light shielding region is formed in an outer periphery of the photomask.

8. The photomask according to claim 1, wherein both the main pattern and the assist pattern are line patterns, and the main pattern is an isolated pattern or a periodic pattern.

9. A manufacturing method of a photomask using an ArF excimer laser as an exposing source, being used for a projection exposure by an off axis illumination, and comprising on a principal plane of a transparent substrate a main pattern transferred to a transfer-target surface by the projection exposure and an assist pattern formed nearby the main pattern and not transferred to the transfer-target surface;

wherein the manufacturing method comprises steps of;

(a) forming a semi-transparent film and a light shielding film sequentially on the principal plane of the transparent substrate, in which the semi-transparent film is a two-layer semi-transparent film and a lower-layer semi-transparent film on the transparent substrate side serves also as an etch stop layer of an upper-layer semi-transparent film, to obtain a film thickness for allowing a retardation of approximately 180°

between a light transmitting through the two-layer semi-transparent film and a light transmitting through a transparent region of the transparent substrate;

(b) forming a first resist pattern on the light shielding film to form a main pattern part and an assist pattern part by sequentially dry-etching the light shielding film and the two-layer semi-transparent film;

(c) peeling off the first resist pattern to subsequently form a second resist pattern on the light shielding film and remove the light shielding film of the assist pattern part by etching;

(d) peeling off the second resist pattern to subsequently dry-etch the whole principal plane of the transparent substrate and form the assist pattern by dry-etching the semi-transparent film of the assist pattern part until a film thickness for allowing a predetermined retardation within a scope of 70°

to 115°

between a light transmitting through the assist pattern and the light transmitting through the transparent region of the transparent substrate is obtained; and

(e) removing the light shielding film of the main pattern part by etching to form the main pattern and generate a retardation of 180°

between a light transmitting through the main pattern and the light transmitting through the transparent region of the transparent substrate.

10. The manufacturing method of a photomask according to claim 9, wherein a film thickness difference between the main pattern and the assist pattern is a predetermined film thickness difference within a scope of 24 nm to 40 nm.

11. The manufacturing method of a photomask according to claim 9 further comprising a step of forming a resist pattern for a light shielding region to form a light shielding region in an outer periphery of the photomask after the step (d) of forming the assist pattern, and the light shielding region is formed at the same time of removing the light shielding film on the main pattern by dry-etching to form the main pattern.