Fan-out fingerprint sensor package

• US 10,395,088 B2
• Filed: 03/15/2018
• Issued: 08/27/2019
• Est. Priority Date: 04/20/2017
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kim, Min Keun, Hur, Young Sik, Baek, Yong Ho, Han, Tae Hee
• Primary Examiner(s): Tran, Binh B
• Application Number:
  US15/922,348
• Publication Number:
  US 20180307890A1
• Time in Patent Office: 530 Days
• Field of Search: 361760-764, 361783
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/18 High density interconnect [HDI] connectors; Manufacturing methods related thereto
• CPC Class Codes: H01L 2224/24155 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/49816 Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/18162 : of a chip with build-up interconnect
• CPC Class Codes: H01L 2924/3511 : Warping
• CPC Class Codes: H05K 1/185 : Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit semiconductor chips encapsulated by interconnect and support structures H01L23/5389, H01L24/00
• CPC Class Codes: H05K 2201/10 : Details of components or other objects attached to or integrated in a printed circuit board
• CPC Class Codes: H05K 2201/10151 : Sensor

Abstract

A fan-out fingerprint sensor package includes a first connection member having a through-hole, a fingerprint sensor disposed in the through-hole, an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor, and a second connection member disposed on the first connection member and an active surface of the fingerprint sensor. The first connection member includes a distribution layer. The second connection member includes a first insulating layer disposed on the distribution layer and the active surface, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to a connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer. The first via passes through the first insulating layer and at least a portion of the encapsulant, and the second via passes through the first insulating layer.

Claims

1. A fan-out fingerprint sensor package comprising:

a first connection member having a through-hole;

a fingerprint sensor disposed in the through-hole of the first connection member, and having an active surface on which a connection pad and a sensing pattern are disposed and an inactive surface opposing the active surface;

an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor; and

a second connection member disposed on the first connection member and the active surface of the fingerprint sensor,

wherein the first connection member includes a distribution layer,

the second connection member includes a first insulating layer disposed on the distribution layer of the first connection member and the active surface of the fingerprint sensor, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to the connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer of the first connection member,

the first via passes through the first insulating layer and at least a portion of the encapsulant,

the second via passes through the first insulating layer, and

the encapsulant encapsulates a side surface and the inactive surface of the fingerprint sensor, and encapsulates at least a portion of the connection pad on the active surface.

2. The fan-out fingerprint sensor package of claim 1, wherein the first via has a height greater than that of the second via.

3. The fan-out fingerprint sensor package of claim 1, wherein the sensing pattern is disposed in a central portion and on one side of the active surface, and the connection pad is disposed on the other side of the active surface.

4. The fan-out fingerprint sensor package of claim 3, wherein the connection pad is disposed only on the other side of the active surface.

5. The fan-out fingerprint sensor package of claim 3, wherein, based on the center of the second connection member, a larger amount of the redistribution layer is formed on the other side of the active surface, as compared to the central portion and one side of the active surface.

6. The fan-out fingerprint sensor package of claim 1, wherein the redistribution layer is not formed on the sensing pattern of the fingerprint sensor.

7. The fan-out fingerprint sensor package of claim 1, wherein the second connection member further includes a second insulating layer disposed on the first insulating layer and covering the redistribution layer.

8. The fan-out fingerprint sensor package of claim 1, wherein the first connection member includes a support layer, a first distribution layer disposed on one surface of the support layer, a second distribution layer disposed on the other surface of the support layer, and a via layer passing through the support layer and electrically connecting the first distribution layer to the second distribution layer, and

the first distribution layer is the distribution layer.

9. The fan-out fingerprint sensor package of claim 8, further comprising:

a backside redistribution layer disposed on the encapsulant;

a backside via passing through at least a portion of the encapsulant, and electrically connecting the second distribution layer to the backside redistribution layer;

a passivation layer disposed on the encapsulant, and having an opening exposing at least a portion of the backside redistribution layer; and

an electrical connection structure disposed on the opening of the passivation layer, and electrically connected to the backside redistribution layer, having been exposed.

10. The fan-out fingerprint sensor package of claim 1, wherein the second via does not pass through the encapsulant.

11. A fan-out fingerprint sensor package comprising:

a first connection member having a through-hole;

a fingerprint sensor disposed in the through-hole of the first connection member, and having an active surface on which a connection pad and a sensing pattern are disposed and an inactive surface opposing the active surface;

an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor; and

a second connection member disposed on the first connection member and the active surface of the fingerprint sensor,

wherein the first connection member includes a distribution layer,

the second connection member includes a first insulating layer disposed on the distribution layer of the first connection member and the active surface of the fingerprint sensor, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to the connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer of the first connection member,

the first via passes through the first insulating layer and at least a portion of the encapsulant,

the second via passes through the first insulating layer,

the first connection member includes a first support layer, a first distribution layer disposed on one surface of the first support layer, a second distribution layer disposed on the other surface of the first support layer, a first via layer passing through the first support layer and electrically connecting the first distribution layer to the second distribution layer, a second support layer disposed on one surface of the first support layer and covering the first distribution layer, a third distribution layer disposed on the second support layer, a second via layer passing through the second support layer and electrically connecting the first distribution layer to the third distribution layer, a third support layer disposed on the other surface of the first support layer and covering the second distribution layer, a fourth distribution layer disposed on the third support layer, and a third via layer passing through the third support layer and electrically connecting the second distribution layer to the fourth distribution layer, and

the third distribution layer is the distribution layer.

12. The fan-out fingerprint sensor package of claim 11, wherein the first support layer has a greater thickness than those of the second support layer and the third support layer.

13. The fan-out fingerprint sensor package of claim 11, further comprising:

a backside redistribution layer disposed on the encapsulant;

a backside via passing through at least a portion of the encapsulant, and electrically connecting the fourth distribution layer to the backside redistribution layer;

a passivation layer disposed on the encapsulant, and having an opening exposing at least a portion of the backside redistribution layer; and

an electrical connection structure disposed on the opening of the passivation layer, and electrically connected to the backside redistribution layer, having been exposed.

14. A fan-out fingerprint sensor package comprising:

a first connection member having a through-hole;

a fingerprint sensor disposed in the through-hole of the first connection member, and having an active surface on which a connection pad and a sensing pattern are disposed and an inactive surface opposing the active surface;

an encapsulant encapsulating at least portions of the first connection member and the fingerprint sensor; and

a second connection member disposed on the first connection member and the active surface of the fingerprint sensor,

wherein the first connection member includes a distribution layer,

the second connection member includes a first insulating layer disposed on the distribution layer of the first connection member and the active surface of the fingerprint sensor, a redistribution layer disposed on the first insulating layer, a first via connecting the redistribution layer to the connection pad of the fingerprint sensor, and a second via connecting the redistribution layer to the distribution layer of the first connection member,

the first via passes through the first insulating layer and at least a portion of the encapsulant,

the second via passes through the first insulating layer,

the first connection member includes a first support layer, a first distribution layer in contact with the first insulating layer and embedded in one surface of the first support layer, a second distribution layer disposed on the other surface of the first support layer opposing one surface in which the first distribution layer is embedded, a first via layer passing through the first support layer and electrically connecting the first distribution layer to the second distribution layer, a second support layer disposed on the first support layer and covering the second distribution layer, a third distribution layer disposed on the second support layer, and a second via layer passing through the second support layer and electrically connecting the second distribution layer to the third distribution layer, and

the first distribution layer is the distribution layer.

15. The fan-out fingerprint sensor package of claim 14, wherein one surface of the first support layer being in contact with the first insulating layer, and one surface of the first distribution layer being in contact with the first insulating layer have a step.

16. The fan-out fingerprint sensor package of claim 14, further comprising:

a backside redistribution layer disposed on the encapsulant;

a backside via passing through at least a portion of the encapsulant, and electrically connecting the third distribution layer to the backside redistribution layer;

a passivation layer disposed on the encapsulant, and having an opening exposing at least a portion of the backside redistribution layer; and

an electrical connection structure disposed on the opening of the passivation layer, and electrically connected to the backside redistribution layer, having been exposed.