Apparatus and methods for inspecting reticles
First Claim
Patent Images
1. A method of qualifying a photolithographic reticle, the method comprising:
- using an imaging tool to acquire a plurality of images at different illumination configurations and/or different imaging configurations from each of a plurality of pattern areas of a test reticle;
recovering a reticle near field for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle; and
using the recovered reticle near field to determine whether the test reticle or another reticle will likely result in an unstable wafer pattern or a defective wafer.
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Abstract
Disclosed are methods and apparatus for qualifying a photolithographic reticle. A reticle inspection tool is used to acquire a plurality of images at different imaging configurations from each of a plurality of pattern areas of a test reticle. A reticle near field is recovered for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle. The recovered reticle near field is then used to determine whether the test reticle or another reticle will likely result in unstable wafer pattern or a defective wafer.
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Citations
26 Claims
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1. A method of qualifying a photolithographic reticle, the method comprising:
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using an imaging tool to acquire a plurality of images at different illumination configurations and/or different imaging configurations from each of a plurality of pattern areas of a test reticle; recovering a reticle near field for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle; and using the recovered reticle near field to determine whether the test reticle or another reticle will likely result in an unstable wafer pattern or a defective wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An imaging system for qualifying a photolithographic reticle, the system comprising:
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a light source for generating an incident beam; an illumination optics module for directing the incident beam onto a reticle; a collection optics module for directing an output beam from each pattern area of the reticle to at least one sensor; at least one sensor for detecting the output beam and generating an image or signal based on the output beam; and a controller that is configured to perform the following operations; causing the acquiring of plurality of images at different illumination configurations and/or different imaging configurations from each of a plurality of pattern areas of a test reticle; recovering a reticle near field for each of the pattern areas of the test reticle based on the acquired images from each pattern area of the test reticle; and using the recovered reticle near field to determine whether the test reticle or another reticle will likely result in an unstable wafer pattern or a defective wafer. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification