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Flexible packaging architecture

  • US 10,396,038 B2
  • Filed: 09/26/2014
  • Issued: 08/27/2019
  • Est. Priority Date: 09/26/2014
  • Status: Active Grant
First Claim
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1. A package comprising:

  • a plurality of silicon dies embedded in a flexible substrate;

    a flexible interposer layer over the embedded dies;

    a thin film thermal distribution layer over the substrate opposite the flexible interposer layer, the flexible substrate being shaped with the dies and the interposer to a curved shape and cured so that the flexible substrate holds its shape; and

    a second plurality of silicon dies embedded in a second flexible substrate, the second flexible substrate being in electrical contact with the flexible interposer opposite the flexible substrate.

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