Method for fabricating electronic package having a protruding barrier frame

• US 10,396,040 B2
• Filed: 05/09/2018
• Issued: 08/27/2019
• Est. Priority Date: 08/05/2016
• Status: Active Grant

• Current Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Siliconware Precision Industries Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Jian, Yue-Ying, Wang, Wei-Ping, Li, Tsung-Ming, Lin, En-Li, Cheng, Kaun-I, Chu, Yu-De
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US15/975,380
• Publication Number:
  US 20180261552A1
• Time in Patent Office: 475 Days
• Field of Search: 257659, 257660, 257723
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48106 the connector being orthogonal to a side surface of the semiconductor or solid-state body, e.g. parallel layout
• CPC Class Codes: H01L 2224/48225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/17 of a plurality of bump connectors
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 25/0655 the devices being arranged next to each other
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01028 Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/1421 RF devices
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

An electronic package is provided, which includes: a carrier; a plurality of electronic elements disposed on the carrier; a bather frame disposed on the carrier and positioned between adjacent two of the electronic elements; an encapsulant formed on the carrier and encapsulating the electronic elements and the bather frame with a portion of the bather frame protruding from the encapsulant; and a shielding element disposed on the encapsulant and being in contact with the portion of the bather frame protruding from the encapsulant. Therefore, the electronic package has an electromagnetic interference (EMI) shielding effect improved. The present disclosure further provides a method for fabricating the electronic package.

Claims

1. A method for fabricating an electronic package, comprising:

disposing a plurality of electronic elements and a barrier frame on a carrier with the barrier frame positioned between adjacent two of the plurality of electronic elements;

forming on the carrier an encapsulant encapsulating the plurality of electronic elements and the barrier frame with a portion of the barrier frame protruding from the encapsulant; and

disposing a shielding element on the encapsulant with the shielding element being in contact with the portion of the barrier frame protruding from the encapsulant.

2. The method of claim 1, wherein the plurality of electronic elements are active elements, passive elements, package structures or any combination thereof.

3. The method of claim 1, wherein the barrier frame is made of a conductive material.

4. The method of claim 1, further comprising, prior to forming the encapsulant, partially covering the barrier frame with a release film.

5. The method of claim 4, further comprising, after forming the encapsulant, removing the release film.

6. The method of claim 1, wherein the shielding element is a conductive layer formed by sputtering on the encapsulant.

7. The method of claim 1, wherein the shielding element is a conductive cover disposed on the encapsulant.

8. The method of claim 1, further comprising forming an insulating layer encapsulating the shielding element.