Method for manufacturing oxide semiconductor device
First Claim
1. A method for manufacturing a semiconductor device, the method comprising steps of:
- forming a gate electrode layer over an insulating surface;
forming a gate insulating layer over the gate electrode layer;
forming an oxide semiconductor layer over the gate insulating layer;
forming a silicon oxide insulating layer over the oxide semiconductor layer;
forming a first opening and a second opening in the silicon oxide insulating layer so that the silicon oxide insulating layer covers and in contact with a periphery of the oxide semiconductor layer and a first region of the oxide semiconductor layer;
forming a source electrode layer in contact with the oxide semiconductor layer through the first opening; and
forming a drain electrode layer in contact with the oxide semiconductor layer through the second opening,wherein the first region of the oxide semiconductor layer comprises a channel formation region,wherein the oxide semiconductor layer comprises indium, gallium, and zinc,wherein the gate electrode layer is a portion of a gate wiring layer,wherein the source electrode layer is a portion of a source wiring layer, andwherein, in a wiring intersection of the gate wiring layer and the source wiring layer, the gate wiring layer, the gate insulating layer, the silicon oxide insulating layer, and the source wiring layer are stacked in this order.
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Accused Products
Abstract
An object is to provide a semiconductor device having a structure with which parasitic capacitance between wirings can be sufficiently reduced. An oxide insulating layer serving as a channel protective layer is formed over part of an oxide semiconductor layer overlapping with a gate electrode layer. In the same step as formation of the oxide insulating layer, an oxide insulating layer covering a peripheral portion of the oxide semiconductor layer is formed. The oxide insulating layer which covers the peripheral portion of the oxide semiconductor layer is provided to increase the distance between the gate electrode layer and a wiring layer formed above or in the periphery of the gate electrode layer, whereby parasitic capacitance is reduced.
202 Citations
19 Claims
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1. A method for manufacturing a semiconductor device, the method comprising steps of:
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forming a gate electrode layer over an insulating surface; forming a gate insulating layer over the gate electrode layer; forming an oxide semiconductor layer over the gate insulating layer; forming a silicon oxide insulating layer over the oxide semiconductor layer; forming a first opening and a second opening in the silicon oxide insulating layer so that the silicon oxide insulating layer covers and in contact with a periphery of the oxide semiconductor layer and a first region of the oxide semiconductor layer; forming a source electrode layer in contact with the oxide semiconductor layer through the first opening; and forming a drain electrode layer in contact with the oxide semiconductor layer through the second opening, wherein the first region of the oxide semiconductor layer comprises a channel formation region, wherein the oxide semiconductor layer comprises indium, gallium, and zinc, wherein the gate electrode layer is a portion of a gate wiring layer, wherein the source electrode layer is a portion of a source wiring layer, and wherein, in a wiring intersection of the gate wiring layer and the source wiring layer, the gate wiring layer, the gate insulating layer, the silicon oxide insulating layer, and the source wiring layer are stacked in this order. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for manufacturing a semiconductor device, the method comprising steps of:
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forming a gate electrode layer over an insulating surface; forming a gate insulating layer over the gate electrode layer; forming an oxide semiconductor layer over the gate insulating layer; forming a silicon oxide insulating layer over the oxide semiconductor layer; forming a first opening and a second opening in the silicon oxide insulating layer so that the silicon oxide insulating layer covers and in contact with a periphery of the oxide semiconductor layer and a first region of the oxide semiconductor layer; forming a source electrode layer in contact with the oxide semiconductor layer through the first opening; forming a drain electrode layer in contact with the oxide semiconductor layer through the second opening; forming an inorganic insulating film over the source electrode layer and the drain electrode layer; forming a third opening in the inorganic insulating film; and forming a pixel electrode layer electrically connected to one of the source electrode layer and the drain electrode layer through the third opening, wherein the first region of the oxide semiconductor layer comprises a channel formation region, wherein the oxide semiconductor layer comprises indium, gallium, and zinc, wherein the gate electrode layer is a portion of a gate wiring layer, wherein the source electrode layer is a portion of a source wiring layer, and wherein, in a wiring intersection of the gate wiring layer and the source wiring layer, the gate wiring layer, the gate insulating layer, the silicon oxide insulating layer, and the source wiring layer are stacked in this order. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method for manufacturing a semiconductor device, the method comprising steps of:
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forming a gate electrode layer over an insulating surface; forming a gate insulating layer over the gate electrode layer; forming a semiconductor layer over the gate insulating layer; forming a first insulating layer over the semiconductor layer; forming a first opening and a second opening in the first insulating layer so that the first insulating layer covers and in contact with a periphery of the semiconductor layer and a first region of the semiconductor layer; forming a source electrode layer to in contact with the semiconductor layer through the first opening; and forming a drain electrode layer to in contact with the semiconductor layer through the second opening, wherein the first region of the semiconductor layer comprises a channel formation region, wherein the gate electrode layer is a portion of a gate wiring layer, wherein the source electrode layer is a portion of a source wiring layer, and wherein, in a wiring intersection of the gate wiring layer and the source wiring layer, the gate wiring layer, the gate insulating layer, the first insulating layer, and the source wiring layer are stacked in this order. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification