Testing transfer-print micro-devices on wafer
First Claim
1. A method of making and testing transfer-printable micro-devices on a source wafer, comprising:
- providing the source wafer comprising a plurality of sacrificial portions spatially separated by anchors, the source wafer comprising one or more test contact pads;
providing at least one micro-device disposed entirely over each of the plurality of sacrificial portions, each of the at least one micro-device physically connected to at least one of the anchors;
providing one or more electrical test connections from each of the at least one micro-device to a corresponding test contact pad;
testing the at least one micro-device disposed over each of the plurality of sacrificial portions through the one or more test connections to determine one or more functional micro-devices and one or more faulty micro-devices; and
removing at least a portion of the one or more test connections.
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Accused Products
Abstract
A method of making and testing transfer-printable micro-devices on a source wafer includes providing a source wafer comprising a plurality of sacrificial portions spatially separated by anchors, the source wafer comprising one or more test contact pads, providing a micro-device entirely over each of the plurality of sacrificial portions, each micro-device physically connected to at least one anchor with one or more tethers, providing one or more electrical test connections from each micro-device to a corresponding test contact pad, testing the micro-devices through the test connections to determine functional micro-devices and faulty micro-devices, and removing at least a portion of the one or more test connections.
192 Citations
18 Claims
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1. A method of making and testing transfer-printable micro-devices on a source wafer, comprising:
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providing the source wafer comprising a plurality of sacrificial portions spatially separated by anchors, the source wafer comprising one or more test contact pads; providing at least one micro-device disposed entirely over each of the plurality of sacrificial portions, each of the at least one micro-device physically connected to at least one of the anchors; providing one or more electrical test connections from each of the at least one micro-device to a corresponding test contact pad; testing the at least one micro-device disposed over each of the plurality of sacrificial portions through the one or more test connections to determine one or more functional micro-devices and one or more faulty micro-devices; and removing at least a portion of the one or more test connections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A transfer-printable micro-device wafer system, comprising:
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a source wafer comprising a plurality of sacrificial portions spatially separated by anchors, the source wafer further comprising one or more test contact pads; a micro-device disposed entirely over each of the plurality of sacrificial portions, the micro-device physically connected to at least one of the anchors by one or more tethers; and one or more electrical test connections electrically connecting the micro-device to a corresponding test contact pad, wherein the one or more test connections are formed on a part of the source wafer other than the one or more tethers. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification