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Testing transfer-print micro-devices on wafer

  • US 10,396,137 B2
  • Filed: 03/08/2018
  • Issued: 08/27/2019
  • Est. Priority Date: 03/10/2017
  • Status: Active Grant
First Claim
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1. A method of making and testing transfer-printable micro-devices on a source wafer, comprising:

  • providing the source wafer comprising a plurality of sacrificial portions spatially separated by anchors, the source wafer comprising one or more test contact pads;

    providing at least one micro-device disposed entirely over each of the plurality of sacrificial portions, each of the at least one micro-device physically connected to at least one of the anchors;

    providing one or more electrical test connections from each of the at least one micro-device to a corresponding test contact pad;

    testing the at least one micro-device disposed over each of the plurality of sacrificial portions through the one or more test connections to determine one or more functional micro-devices and one or more faulty micro-devices; and

    removing at least a portion of the one or more test connections.

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