Light emitting component

• US 10,396,255 B2
• Filed: 11/27/2017
• Issued: 08/27/2019
• Est. Priority Date: 06/12/2014
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Genesis Photonics Inc.
• Inventors: Huang, Kuan-Chieh, Ting, Shao-Ying, Huang, Jing-En, Huang, Yi-Ru
• Primary Examiner(s): Abdelaziez, Yasser A
• Application Number:
  US15/823,480
• Publication Number:
  US 20180083168A1
• Time in Patent Office: 638 Days
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A light emitting component includes a light emitting unit, a molding compound and a wavelength converting layer. The light emitting unit has a forward light emitting surface. The molding compound covers the light emitting unit. The wavelength converting layer is disposed above the molding compound. The wavelength converting layer has a first surface and a second surface opposite to the first surface, wherein the first surface is located between the forward light emitting surface and the second surface, and at least one of the first and second surfaces is non-planar.

Claims

1. A light emitting component, comprising:

a light emitting unit having electrodes disposed a lower surface thereof;

a reflective layer attached to a side surface of the light emitting unit and at least exposing the electrodes and a top surface of the light emitting unit;

a wavelength conversion layer disposed over the light emitting unit and the reflective layer; and

an encapsulation layer, disposed between the light emitting unit and the wavelength conversion layer, covering the top surface of the light emitting unit and at least a portion of the reflective layer,

wherein the wavelength conversion layer has a non-planar surface and the light emitting component has a flat side surface comprising the reflective layer and the wavelength conversion layer.

2. The light emitting component of claim 1, wherein the electrodes are protruded from a lower surface of the reflective layer.

3. The light emitting component of claim 1, wherein the non-planar surface is located at one side of the wavelength conversion layer opposite to the light emitting unit.

4. The light emitting component of claim 1, wherein the non-planar surface is located at one side of the wavelength conversion layer facing to the light emitting unit.

5. The light emitting component of claim 4, wherein a thickness of the encapsulation layer is not uniform.

6. The light emitting component of claim 4, wherein the electrodes are protruded from a lower surface of the reflective layer.

7. The light emitting component of claim 4, wherein the flat side surface further comprises the encapsulation layer.

8. The light emitting component of claim 3, wherein a thickness of the encapsulation layer is not uniform.

9. The light emitting component of claim 3, wherein the electrodes are protruded from a lower surface of the reflective layer.

10. The light emitting component of claim 3, wherein the flat side surface further comprises the encapsulation layer.

11. The light emitting component of claim 3, wherein an interface between the wavelength conversion layer and the encapsulation layer is non-planar.

12. The light emitting component of claim 2, wherein a thickness of the encapsulation layer is not uniform.

13. The light emitting component of claim 2, wherein the flat side surface further comprises the encapsulation layer.

14. The light emitting component of claim 1, wherein a thickness of the encapsulation layer is not uniform.

15. The light emitting component of claim 1, wherein the flat side surface further comprises the encapsulation layer.