Garment integrated electrical interface system and method of manufacture
First Claim
1. A system for electrically coupling a garment to a mating object, the system comprising:
- a fabric interlayer of the garment including a set of embedded ports in electrical communication with at least one biometric sensor;
a backing plate, adjacent to a first side of the fabric interlayer, comprising;
a set of through holes aligned with the set of embedded ports;
an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and comprising;
a set of vias through a thickness of the electronics substrate, and aligned with the set of through holes and the set of embedded ports, anda set of raised contacts at a second surface opposing the first surface, each raised contact in the set of raised contacts electrically connected to a via in the set of vias;
a mount assembly having a third surface adjacent to the second surface of the electronics substrate and comprising;
a set of blind holes aligned with the set of vias, the set of embedded ports, and the set of through holes,a set of openings that correspond to and receive portions of the set of raised contacts, anda fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and
a set of fasteners that
1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of through holes, the set of embedded ports, the set of vias, and the set of blind holes in supporting a waterproof seal, and
2) electrically couple the set of embedded ports and the set of vias,wherein at least one embedded port in the set of embedded ports is electrically conductive and secured to the fabric interlayer such that at least a portion of an embedded port is adjacent to the electronics substrate and brought into electrical communication with a via in the set of vias.
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Accused Products
Abstract
A system for electrically coupling a garment to a mating object and manufacture method thereof, the system comprising: a fabric interlayer of the garment including a set of ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and including a set of vias through a thickness of the electronics substrate, aligned with the set of ports, and a set of contacts at a second surface opposing the first surface; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and including a set of holes aligned with the set of vias and the set of ports, as well as a set of openings that correspond to and receive portions of the set of contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that 1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of ports, the set of vias, and the set of holes in supporting a waterproof seal, and 2) electrically couple the set of embedded ports to the set of vias.
96 Citations
19 Claims
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1. A system for electrically coupling a garment to a mating object, the system comprising:
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a fabric interlayer of the garment including a set of embedded ports in electrical communication with at least one biometric sensor; a backing plate, adjacent to a first side of the fabric interlayer, comprising; a set of through holes aligned with the set of embedded ports; an electronics substrate having a first surface adjacent to a second side of the fabric interlayer and comprising; a set of vias through a thickness of the electronics substrate, and aligned with the set of through holes and the set of embedded ports, and a set of raised contacts at a second surface opposing the first surface, each raised contact in the set of raised contacts electrically connected to a via in the set of vias; a mount assembly having a third surface adjacent to the second surface of the electronics substrate and comprising; a set of blind holes aligned with the set of vias, the set of embedded ports, and the set of through holes, a set of openings that correspond to and receive portions of the set of raised contacts, and a fourth surface opposing the third surface and defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; and a set of fasteners that
1) compress the backing plate, the fabric interlayer, the electronics substrate, and the mount assembly by way of the set of through holes, the set of embedded ports, the set of vias, and the set of blind holes in supporting a waterproof seal, and
2) electrically couple the set of embedded ports and the set of vias,wherein at least one embedded port in the set of embedded ports is electrically conductive and secured to the fabric interlayer such that at least a portion of an embedded port is adjacent to the electronics substrate and brought into electrical communication with a via in the set of vias. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A system for electrically coupling a garment to a mating object, the system comprising:
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a fabric interlayer of the garment including a set of embedded ports; an electronics substrate adjacent to the fabric interlayer, comprising a set of vias; a mount assembly, defining a cavity configured to receive and electrically interface the mating object to the electronics substrate; a set of fasteners, configured to compress the mount assembly and the electronics substrate against the fabric interlayer in supporting a waterproof seal, each fastener in the set of fasteners concentrically aligned with and passing through an embedded port in the set of embedded ports and a via in the set of vias in providing a mechanical and electrical connection between the embedded port and the via, wherein the set of embedded ports is a set of grommets, wherein at least one grommet in the set of grommets is electrically conductive and secured to the fabric interlayer such that at least a portion of a grommet is adjacent to the electronics substrate and brought into electrical communication with a via in the set of vias. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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Specification