Transparent heat exchanger

• US 10,401,099 B2
• Filed: 10/05/2016
• Issued: 09/03/2019
• Est. Priority Date: 10/05/2016
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Koontz, Christopher R., Filgas, David
• Primary Examiner(s): Attey, Joel M
• Application Number:
  US15/285,867
• Publication Number:
  US 20180094882A1
• Time in Patent Office: 1,063 Days
• Field of Search: 165185
• CPC Class Codes: F28F 21/00 Constructions of heat-exchange apparatus characterised by the selection of particular materials coatings for modifying heat-transfer F28F13/18; coatings for preventing the formation of deposits or corrosion F28F19/02
• CPC Class Codes: F28F 21/006 of glass
• CPC Class Codes: F28F 21/02 of carbon, e.g. graphite
• CPC Class Codes: F28F 21/04 of ceramic; of concrete; of natural stone
• CPC Class Codes: F28F 21/081 Heat exchange elements made from metals or metal alloys
• CPC Class Codes: F28F 2255/00 Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
• CPC Class Codes: F28F 3/02 Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations F28F3/08 takes precedence
• CPC Class Codes: F28F 3/04 the means being integral with the element
• CPC Class Codes: G02B 7/008 with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
• CPC Class Codes: G02B 7/1815 with cooling or heating systems cooling arrangements for laser mirrors H01S3/0401
• CPC Class Codes: H01S 3/0401 of optical elements being part of laser resonator, e.g. windows, mirrors, lenses
• CPC Class Codes: H01S 3/0405 Conductive cooling, e.g. by heat sinks or thermo-electric elements
• CPC Class Codes: H01S 3/0407 Liquid cooling, e.g. by water
• CPC Class Codes: H01S 3/2308 Amplifier arrangements, e.g. MOPA
• CPC Class Codes: H01S 5/02423 Liquid cooling, e.g. a liquid cools a mount of the laser
• CPC Class Codes: H01S 5/02438 Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
• CPC Class Codes: H01S 5/02476 Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements

Abstract

In one aspect, a transparent heat exchanger includes a first transparent substrate optically attached to a heat source, one or more fins to transfer heat from the heat source, the one or more fins comprising transparent material and further comprising one of a manifold coupled to the first transparent substrate or a facesheet coupled to the first transparent material.

Claims

1. A transparent heat exchanger comprising:

a first transparent substrate attached to a heat source, the first transparent substrate comprising etched troughs defining one or more fins oriented away from the heat source such that the one or more fins extend from the side of the substrate opposite to the heat source and towards a manifold to transfer heat from the heat source, the one or more fins comprising transparent material, and wherein the etched troughs are configured to carry coolant; and

the manifold comprising channels used to supply coolant to the one or more fins and to return coolant from the one or more fins, the manifold coupled to the first transparent substrate with a thermal optical interface such that the one or more fins interface with the channels.

2. The transparent heat exchanger of claim 1, wherein the manifold is bonded to the first transparent substrate.

3. The transparent heat exchanger of claim 1, further comprising a second transparent substrate.

4. The transparent heat exchanger of claim 3, wherein the second substrate is bonded to the first substrate.

5. The transparent heat exchanger of claim 3, wherein the second substrate is bonded to the manifold.

6. The transparent heat exchanger of claim 3, wherein the second transparent substrate comprises at least one of indium phosphate, silicon, silicon carbide, fused silica, sapphire, germanium, zinc selenide, zinc sulfide, diamond or any combination thereof.

7. The transparent heat exchanger of claim 1, wherein the first transparent substrate comprises at least one of indium phosphate, silicon, silicon carbide, fused silica, sapphire, germanium, zinc selenide, zinc sulfide, diamond or any combination thereof.

8. The transparent heat exchanger of claim 1, wherein a coefficient of thermal expansion (CTE) of the first transparent substrate and the CTE of the heat source are about equal.

9. The transparent heat exchanger of claim 1, wherein the manifold is along one or both ends of the first transparent substrate.

10. The transparent heat exchanger of claim 1, wherein the manifold is partially or wholly surrounds the first transparent substrate.

11. A method to cool a heat source, comprising:

attaching a transparent heat exchanger to the heat source, wherein the transparent heat exchanger includes;

a first transparent substrate attached to the heat source, the first transparent substrate comprising etched troughs defining one or more fins oriented away from the heat source such that the one or more fins extend from the side of the substrate opposite to the heat source and towards a manifold to transfer heat from the heat source to a coolant in contact with the one or more fins, the one or more fins comprising transparent material and wherein the etched troughs are configured to carry coolant, and

the manifold comprising channels used to supply the coolant to the one or more fins and to return the coolant from the one or more fins, the manifold coupled to the first transparent substrate with a thermal optical interface such that the one or more fins interface with the channels.