Integrated circuit
First Claim
1. An integrated circuit for a packaged device, the circuit comprising:
- a circuit having first and second electromagnetic radiating elements fabricated on a die, wherein the first and second electromagnetic radiating elements are on different signal paths;
a package substrate comprising an upper surface and a lower surface; and
a grounding layer provided directly on the lower surface of the package substrate, the grounding layer being adapted to connect to a grounding plane of a printed circuit board, PCB,wherein the die is mounted on the upper surface of the package substrate,wherein the grounding layer comprises a void positioned so as to electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element, andwherein at least a portion of the void is positioned directly below an area extending between the first and second electromagnetic radiating elements.
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Accused Products
Abstract
An integrated circuit for a packaged device is proposed. The circuit comprises: a circuit having first and second electromagnetic radiating elements fabricated on a die; a package substrate comprising an upper surface and a lower surface; and a grounding layer provided on the lower surface of the package substrate, the grounding layer being adapted to connect to a grounding plane of a printed circuit board. The die is mounted on the upper surface of the package substrate. The grounding layer comprises a void, at least a portion of the void being positioned so as to at least partially electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element.
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Citations
15 Claims
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1. An integrated circuit for a packaged device, the circuit comprising:
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a circuit having first and second electromagnetic radiating elements fabricated on a die, wherein the first and second electromagnetic radiating elements are on different signal paths; a package substrate comprising an upper surface and a lower surface; and a grounding layer provided directly on the lower surface of the package substrate, the grounding layer being adapted to connect to a grounding plane of a printed circuit board, PCB, wherein the die is mounted on the upper surface of the package substrate, wherein the grounding layer comprises a void positioned so as to electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element, and wherein at least a portion of the void is positioned directly below an area extending between the first and second electromagnetic radiating elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15)
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14. A method of manufacturing an integrated circuit comprising:
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providing a circuit having first and second electromagnetic radiating elements fabricated on a die, wherein the first and second electromagnetic radiating elements are on different signal paths; providing a package substrate including an upper surface and a lower surface, a grounding layer being provided directly on the lower surface of the package substrate and including a void, wherein the grounding layer is adapted to connect to a grounding plane of a PCB; and mounting the die on the upper surface of the package substrate such that the void is positioned so as to electromagnetically isolate the first electromagnetic radiating element from the second electromagnetic radiating element, wherein at least a portion of the void is positioned directly below an area extending between the first and second electromagnetic radiating elements.
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Specification