Carrier assembly for blood pressure module

• US 10,405,758 B2
• Filed: 11/06/2015
• Issued: 09/10/2019
• Est. Priority Date: 11/07/2014
• Status: Active Grant

• Current Assignee: Welch Allyn Incorporated
• Original Assignee: Welch Allyn Incorporated
• Inventors: Knieriem, Alan S.
• Primary Examiner(s): Natnithithadha, Navin
• Assistant Examiner(s): Shostak, Andrey
• Application Number:
  US14/934,834
• Publication Number:
  US 20160128585A1
• Time in Patent Office: 1,404 Days
• CPC Class Codes: A61B 2560/0204 of power management
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/166 the sensor is mounted on a specially adapted printed circuit board
• CPC Class Codes: A61B 5/002 Monitoring the patient using a local or closed circuit, e.g. in a room or building A61B5/0017 takes precedence
• CPC Class Codes: A61B 5/02055 Simultaneously evaluating both cardiovascular condition and temperature
• CPC Class Codes: A61B 5/02141 Details of apparatus construction, e.g. pump units or housings therefor, cuff pressurising systems, arrangements of fluid conduits or circuits A61B5/02233, A61B5/0235 take precedence
• CPC Class Codes: A61B 5/02233 Occluders specially adapted therefor tourniquets A61B17/132
• CPC Class Codes: A61B 5/0235 Valves specially adapted therefor
• CPC Class Codes: A61B 5/7405 using sound
• CPC Class Codes: A61B 5/742 using visual displays A61B5/339 takes precedence
• CPC Class Codes: A61B 50/13 Trolleys, e.g. carts
• CPC Class Codes: G02F 1/133308 Support structures for LCD panels, e.g. frames or bezels
• CPC Class Codes: G02F 1/13332 Front frames
• CPC Class Codes: G02F 1/133325 Assembling processes
• CPC Class Codes: H02J 7/342 The other DC source being a battery actively interacting with the first one, i.e. battery to battery charging with circuits for polarity protection H02J7/0034
• CPC Class Codes: H05K 1/0216 Reduction of cross-talk, noise or electromagnetic interference grounding H05K1/0215
• CPC Class Codes: H05K 1/0296 Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295 H05K1/11 takes precedence; lay-out adapted to mounted component configuration H05K1/18
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/1003 : Non-printed inductor

Abstract

A carrier assembly includes a sub-assembly including a pump, at least one solenoid valve, and a check valve. The pump, the at least one solenoid valve, and the check valve are in fluid communication with each other and with at least one pressure transducer via a manifold. Also, the carrier assembly is configured to be mounted to a medical device'"'"'s main assembly board.

Claims

1. A blood pressure module, comprising:

a blood pressure cuff connector;

a main printed circuit assembly;

a manifold positioned on the main printed circuit assembly and forming a fluid connection with the blood pressure cuff connector;

at least one pressure transducer positioned on the main printed circuit assembly; and

a carrier configured to be mounted to the main printed circuit assembly, wherein the carrier supports;

a pump;

at least one solenoid valve positioned adjacent to the pump;

a check valve positioned adjacent to both the pump and the at least one solenoid valve, wherein the pump, the at least one solenoid valve and the check valve are in fluid communication with each other and with the at least one pressure transducer via the manifold;

a speaker;

a wireless radio; and

an integrated wire harness holding at least one wire for each of;

the pump, the at least one solenoid valve, the check valve, the speaker, and the wireless radio;

wherein the main printed circuit assembly has a first surface area on a top surface of the main printed circuit assembly; and

wherein the components supported by the carrier occupy an amount of surface area on the top surface that is at least less than half of the first surface area.

2. The blood pressure module of claim 1, wherein the carrier is carried on the main printed circuit assembly.

3. The blood pressure module of claim 2, wherein the carrier and the main printed circuit assembly form an integrated assembly.

4. The blood pressure module of claim 1, wherein the carrier comprises pump retention snaps for supporting the pump.

5. The blood pressure module of claim 1, wherein the carrier includes a speaker mount for the speaker and a wireless radio mount for the wireless radio.

6. The blood pressure module of claim 1, wherein the carrier includes an integrated pump/valve harness.