Encapsulated conformal electronic systems and devices, and methods of making and using the same

• US 10,410,962 B2
• Filed: 01/06/2015
• Issued: 09/10/2019
• Est. Priority Date: 01/06/2014
• Status: Active Grant

• Current Assignee: Medidata Solutions Incorporated (Dassault Systemes SA)
• Original Assignee: MC10, Inc.
• Inventors: McMahon, Nicholas, Wang, Xianyan, Elolampi, Brian, Keen, Bryan D., Garlock, David G.
• Primary Examiner(s): Lu, Farun
• Application Number:
  US15/108,861
• Publication Number:
  US 20160322283A1
• Time in Patent Office: 1,708 Days
• Field of Search: 257419
• CPC Class Codes: H01H 13/86 characterised by the casing, e.g. sealed casings or casings reducible in size
• CPC Class Codes: H01L 21/0206 during, before or after processing of insulating layers
• CPC Class Codes: H01L 21/4864 Cleaning, e.g. removing of solder
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/296 Organo-silicon compounds
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49894 Materials of the insulating layers or coatings
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate arc fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.

Claims

1. A conformal integrated circuit (IC) device comprising:

a flexible substrate;

electronic circuitry attached to the flexible substrate; and

a flexible polymeric encapsulation layer attached to the flexible substrate, the flexible polymeric encapsulation layer forming a vaulted compartment encasing therein at least a portion of the electronic circuitry between the flexible substrate and the vaulted compartment of the flexible polymeric encapsulation layer,

wherein the vaulted compartment is separated from a second vaulted compartment by a recessed portion, and the flexible polymeric encapsulation layer and the flexible substrate have a collective thickness in the range of about 1.0 mm to about 2.0 mm.

2. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer comprises a stretchable and bendable non-conductive material.

3. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer is fabricated from a polyimide (PI), a polyethylene terephthalate (PET), a silicone, or a polyurethane, or any combination thereof.

4. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer is configured to hermetically seal the electronic circuitry.

5. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer is fabricated from an ultraviolet (UV) curable silicone.

6. The conformal IC device of claim 1, wherein the flexible substrate comprises a stretchable and bendable non-conductive polymeric material.

7. The conformal IC device of claim 1, wherein the flexible substrate is fabricated from a polyimide (PI), a polyethylene terephthalate (PET), a silicone, or a polyurethane, or any combination thereof.

8. The conformal IC device of claim 1, wherein the electronic circuitry comprises an integrated circuit sensor system with at least one sensing device and at least one controller device.

9. The conformal IC device of claim 1, wherein the electronic circuitry comprises a plurality of spaced device islands electrically and physically connected via a plurality of stretchable electrical interconnects.

10. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer is configured to facilitate modulation of a stress or a strain, or both, on a predetermined portion of the conformal IC device by adjusting a location of a neutral mechanical plane relative to a functional component of the electronic circuitry.

11. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer and the substrate both have an elongation in the range of about 200% to about 800%.

12. The conformal IC device of claim 1, further comprising a series of flexible polymeric encapsulation layers disposed on top of the flexible polymeric encapsulation layer.

13. The conformal IC device of claim 1, further comprising a base plate disposed on the flexible substrate, and an electrical contact disposed on the base plate, wherein the electronic circuitry is attached to the electrical contact.

14. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer is adhered to the flexible substrate via a liquid silicone adhesive coating.

15. The conformal IC device of claim 1, wherein the conformal IC device has an overall thickness in the range of about 1 mm to about 6 mm.

16. The conformal IC device of claim 1, wherein the flexible polymeric encapsulation layer attached to the flexible substrate forms a housing defining a major central first axis and a central transverse second axis, and wherein housing deformations are generally restricted to stretching along one of the first and second axes and to bending along the other of the first and second axes.

17. A conformal electronics device comprising:

an elongated flexible polymeric substrate;

a plurality of surface-mount technology (SMT) components configured as device islands attached to the elongated flexible polymeric substrate;

a plurality of stretchable interconnects electrically connecting the SMT components; and

a flexible polymeric encapsulation layer attached to the elongated flexible polymeric substrate, the flexible polymeric encapsulation layer forming a vaulted compartment encasing therein at least a portion of the SMT components and the stretchable interconnects between the elongated flexible polymeric substrate and the vaulted compartment of the flexible polymeric encapsulation layer,

wherein the vaulted compartment is separated from a second vaulted compartment by a recessed portion, and the flexible polymeric encapsulation layer and the elongated flexible polymeric substrate have a collective thickness in the range of about 1.0 mm to about 2.0 mm.

18. The conformal electronics device of claim 17, wherein the flexible polymeric encapsulation layer comprises a stretchable and bendable non-conductive material.

19. The conformal electronics device of claim 17, wherein the flexible polymeric encapsulation layer is fabricated from a polyimide (PI), a polyethylene terephthalate (PET), a silicone, or a polyurethane, or any combination thereof.

20. The conformal electronics device of claim 17, wherein the flexible polymeric encapsulation layer is configured to hermetically seal the conformal electronics device.

21. The conformal electronics device of claim 17, wherein the elongated flexible polymeric substrate comprises a stretchable and bendable non-conductive material.

22. The conformal electronics device of claim 17, wherein the elongated flexible polymeric substrate is fabricated from a polyimide (PI), a polyethylene terephthalate (PET), a silicone, or a polyurethane, or any combination thereof.

23. The conformal electronics device of claim 17, wherein the SMT components include at least one sensing device and at least one controller device.

24. The conformal electronics device of claim 17, wherein the flexible polymeric encapsulation layer is configured to facilitate modulation of a stress or a strain, or both, on a predetermined portion of the conformal electronics device by adjusting a location of a neutral mechanical plane relative to the SMT components and the stretchable interconnects.

25. The conformal electronics device of claim 17, wherein the flexible polymeric encapsulation layer and the elongated flexible polymeric substrate both have an elongation in the range of about 200% to about 800%.

26. The conformal electronics device of claim 17, further comprising a series of flexible polymeric encapsulation layers disposed on top of the flexible polymeric encapsulation layer.

27. The conformal electronics device of claim 17, further comprising a base plate disposed on the elongated flexible polymeric substrate, and an electrical contact disposed on the base plate, wherein one or more of the SMT components or the stretchable interconnects are attached to the electrical contact.

28. The conformal electronics device of claim 17, wherein the flexible polymeric encapsulation layer is adhered to the elongated flexible polymeric substrate via a liquid silicone adhesive coating.

29. The conformal electronics device of claim 17, wherein the conformal electronics device has an overall thickness in the range of about 1 mm to about 6 mm.

30. The conformal electronics device of claim 17, wherein the flexible polymeric encapsulation layer attached to the elongated flexible polymeric substrate forms a housing defining a major central first axis and a central transverse second axis, and wherein housing deformations are generally restricted to stretching along one of the first and second axes and to bending along the other of the first and second axes.