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Semiconductor device and communication system

  • US 10,411,037 B2
  • Filed: 06/30/2016
  • Issued: 09/10/2019
  • Est. Priority Date: 06/14/2004
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a plastic substrate;

    an adhesive agent over the plastic substrate;

    an insulating film over the adhesive agent; and

    a processor over the insulating film, the processor comprising;

    an integrated circuit over the insulating film, the integrated circuit comprising a voltage generation circuit; and

    an antenna over the insulating film, the antenna being connected to the voltage generation circuit,wherein the voltage generation circuit and an entirety of the antenna overlap the insulating film,wherein the integrated circuit comprises a transistor, andwherein a power is provided to the voltage generation circuit through the antenna.

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