Semiconductor device and communication system
First Claim
1. A semiconductor device comprising:
- a plastic substrate;
an adhesive agent over the plastic substrate;
an insulating film over the adhesive agent; and
a processor over the insulating film, the processor comprising;
an integrated circuit over the insulating film, the integrated circuit comprising a voltage generation circuit; and
an antenna over the insulating film, the antenna being connected to the voltage generation circuit,wherein the voltage generation circuit and an entirety of the antenna overlap the insulating film,wherein the integrated circuit comprises a transistor, andwherein a power is provided to the voltage generation circuit through the antenna.
0 Assignments
0 Petitions
Accused Products
Abstract
It is an object of the present invention to provide a semiconductor device in which a sophisticated integrated circuit using a polycrystalline semiconductor is formed over a substrate which is weak with heat such as a plastic substrate or a plastic film substrate and a semiconductor device which transmits/receives power or a signal without wires, and a communication system thereof. One feature of the invention is that a semiconductor device, specifically, a processor, in which a sophisticated integrated circuit is fixed to a plastic substrate which is weak with heat by a stripping method such as a stress peel of process method to transmit/receive power or a signal without wires, for example, with an antenna or a light receiving element.
-
Citations
21 Claims
-
1. A semiconductor device comprising:
-
a plastic substrate; an adhesive agent over the plastic substrate; an insulating film over the adhesive agent; and a processor over the insulating film, the processor comprising; an integrated circuit over the insulating film, the integrated circuit comprising a voltage generation circuit; and an antenna over the insulating film, the antenna being connected to the voltage generation circuit, wherein the voltage generation circuit and an entirety of the antenna overlap the insulating film, wherein the integrated circuit comprises a transistor, and wherein a power is provided to the voltage generation circuit through the antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7)
-
-
8. A semiconductor device comprising:
-
a plastic substrate; an adhesive agent over the plastic substrate; an insulating film over the adhesive agent; and a processor over the insulating film, the processor comprising; an integrated circuit over the insulating film, the integrated circuit comprising a voltage generation circuit; an antenna over the insulating film, the antenna being connected to the voltage generation circuit; and a light receiving element, wherein the voltage generation circuit and an entirety of the antenna overlap the insulating film, wherein the integrated circuit comprises a transistor, and wherein a power is provided to the voltage generation circuit through the antenna. - View Dependent Claims (9, 10, 11, 12, 13, 14)
-
-
15. A semiconductor device comprising:
a plastic substrate; an adhesive agent over the plastic substrate; a crystallized metal oxide comprising tungsten over the adhesive agent; and a processor over the crystallized metal oxide, the processor comprising; an integrated circuit comprising a voltage generation circuit; and an antenna connected to the voltage generation circuit, wherein the integrated circuit comprises a transistor, and wherein a power is provided to the voltage generation circuit through the antenna. - View Dependent Claims (16, 17, 18, 19, 20, 21)
Specification