Fabrication of shielded gate trench MOSFET with increased source-metal contact
First Claim
1. A method of forming a semiconductor device on a semiconductor substrate having a substrate top surface, comprising:
- forming a gate trench extending from the substrate top surface into the semiconductor substrate, including by;
forming spacers; and
performing self-aligned etching using the spacers;
forming a gate electrode in the gate trench;
removing the spacers and leaving at least a curved sidewall portion along at least a portion of a sidewall of the gate trench;
forming a body region adjacent to the gate trench;
forming a source region embedded in the body region, including disposing source material in a region that is along at least a part of the curved sidewall portion;
forming a gate top dielectric layer over the gate electrode, the gate top dielectric layer having a top side that is below at least a curved portion of the source region; and
forming a metal layer over at least a portion of a gate trench opening and at least a portion of the source region.
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Abstract
Forming a semiconductor device on a semiconductor substrate having a substrate top surface includes: forming a gate trench extending from the substrate top surface into the semiconductor substrate; forming a gate electrode in the gate trench; forming a curved sidewall portion along at least a portion of a sidewall of the gate trench; forming a body region adjacent to the gate trench; forming a source region embedded in the body region, including disposing source material in a region that is along at least a part of the curved sidewall portion; forming a gate top dielectric layer over the gate electrode and having a top side that is below at least a portion of the source region; and forming a metal layer over at least a portion of a gate trench opening and at least a portion of the source region.
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Citations
11 Claims
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1. A method of forming a semiconductor device on a semiconductor substrate having a substrate top surface, comprising:
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forming a gate trench extending from the substrate top surface into the semiconductor substrate, including by; forming spacers; and performing self-aligned etching using the spacers; forming a gate electrode in the gate trench; removing the spacers and leaving at least a curved sidewall portion along at least a portion of a sidewall of the gate trench; forming a body region adjacent to the gate trench; forming a source region embedded in the body region, including disposing source material in a region that is along at least a part of the curved sidewall portion; forming a gate top dielectric layer over the gate electrode, the gate top dielectric layer having a top side that is below at least a curved portion of the source region; and forming a metal layer over at least a portion of a gate trench opening and at least a portion of the source region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification