Hybrid electrical connector

• US 10,411,392 B2
• Filed: 06/15/2018
• Issued: 09/10/2019
• Est. Priority Date: 02/20/2017
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Manushi, Ligor, Reyes, Mario, Avalos, Hiram, Ryskamp, Mark, McInnis, Allison, Oberender, Jens, Schoenfeld, Michael, Moore, Alexander, Keller, Robert
• Primary Examiner(s): Gilman, Alexander
• Application Number:
  US16/009,430
• Publication Number:
  US 20180294594A1
• Time in Patent Office: 452 Days
• Field of Search: 439695
• CPC Class Codes: H01R 13/405 Securing in non-demountable manner, e.g. moulding, riveting
• CPC Class Codes: H01R 13/504 different pieces being moulded, cemented, welded, e.g. ultrasonic, or swaged together
• CPC Class Codes: H01R 13/5202 Sealing means between parts of housing or between housing part and a wall, e.g. sealing rings
• CPC Class Codes: H01R 13/5219 Sealing means between coupling parts, e.g. interfacial seal
• CPC Class Codes: H01R 43/18 for manufacturing bases or cases for contact members
• CPC Class Codes: H01R 43/24 Assembling by moulding on contact members

Abstract

A hybrid electrical connector includes a housing having a central opening, a carrier plate supported by the housing within the central opening, and electrically conductive pins supported within the housing by the carrier plate. The housing is formed of a first plastic material, and the carrier plate is formed of a second plastic material having properties that make it more dimensionally stable than the first plastic material. In addition, a sealing layer is applied to one surface of the carrier plate, the sealing layer formed of a third plastic material and serving to secure the carrier plate to the housing and to secure the pins within the carrier plate. A method of forming the electrical connector is also described.

Claims

1. A method of fabricating an electrical connector comprising

providing electrically conductive pins arranged in an array in which each pin is spaced apart from and parallel to adjacent pins of the array;

performing a first overmolding procedure on the pins in which a carrier plate is provided, the carrier plate formed of a first plastic material that supports the pins in the arrayed configuration;

performing a second overmolding procedure on the carrier plate in which a housing is provided, the housing formed of a second plastic material and surrounding a periphery of the carrier plate in such a way that an outer periphery of the carrier plate engages an inner periphery of the housing; and

following the second overmolding procedure, applying a sealing layer formed of a third plastic material to one side of the carrier plate in such a way as to seal the pins to the carrier plate and seal the carrier plate to the housing.

2. The method of claim 1 wherein the first overmolding procedure is performed in a first apparatus, the second overmolding procedure is performed in a second apparatus, and the carrier plate is transferred between the first apparatus and the second apparatus following the first overmolding procedure, whereby cooling of the carrier plate occurs between the first overmolding procedure and the second overmolding procedure.

3. The method of claim 1 wherein the first over folding procedure and the second overmolding procedure are performed in a first apparatus, and the carrier plate is remains in the first apparatus for both the first overmolding procedure and the second overmolding procedure, and the second overmolding procedure is performed immediately following the first overmolding procedure, whereby a portion of a first material used in the first overmolding procedure forms a chemical bond with a portion of a second material used in the second overmolding procedure.

4. The method of claim 1 wherein the array of pins is provided prior to the step of performing a first overmolding procedure on the pins whereby the carrier plate is formed with the array of pins in place.

5. The method of claim 1 wherein the array of pins is provided following the step of performing a second overmolding procedure on the carrier plate in which a housing is provided, and the pins are inserted into preexisting openings in the carrier plate.

6. A method of fabricating an electrical connector comprising

providing electrically conductive pins arranged in an array in which each pin is spaced apart from and parallel to adjacent pins of the array;

performing a first overmolding procedure on the pins in which a carrier plate is provided, the carrier plate formed of a first plastic material that supports the pins in the arrayed configuration;

performing a second overmolding procedure on the carrier plate in which a housing is provided, the housing formed of a second plastic material and surrounding a periphery of the carrier plate in such a way that, an outer periphery of the carrier plate engages an inner periphery of the housing; and

following the second overmolding procedure, applying a sealing layer formed of a third plastic material to one side of the carrier plate in such a way as to seal the pins to the carrier plate and seal the carrier plate to the housing,

wherein

the first overmolding procedure is performed in a first apparatus, the second overmolding procedure is performed in a second apparatus, and the carrier plate is transferred between the first apparatus and the second apparatus following the first overmolding procedure, whereby cooling of the carrier plate occurs between the first overmolding procedure and the second overmolding procedure.

7. A method of fabricating an electrical connector comprising

providing electrically conductive pins arranged in an array in which each pin is spaced apart from and parallel to adjacent pins of the array;

performing a first overmolding procedure on the pins in which a carrier plate is provided, the carrier plate formed of a first plastic material that supports the pins in the arrayed configuration;

performing a second overmolding procedure on the carrier plate in which a housing is provided, the housing formed of a second plastic material and surrounding a periphery of the carrier plate in such a way that an outer periphery of the carrier plate engages an inner periphery of the housing; and

following the second overmolding procedure, applying a sealing layer formed of a third plastic material to one side of the carrier plate in such a way as to seal the pins to the carrier plate and seal the carrier plate to the housing,

wherein

the first overmolding procedure and the second overmolding procedure are performed in a first apparatus, and the carrier plate is remains in the first apparatus for both the first overmolding procedure and the second overmolding procedure, and the second overmolding procedure is performed immediately following the first overmolding procedure, whereby a portion of a first material used in the first overmolding procedure forms a chemical bond with a portion of a second material used in the second overmolding procedure.