Configuration element for printed circuit board assemblies

• US 10,412,825 B2
• Filed: 08/13/2018
• Issued: 09/10/2019
• Est. Priority Date: 09/21/2016
• Status: Active Grant

• Current Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Original Assignee: Seagate Technology LLC (Seagate Technology Holdings Plc)
• Inventors: Davis, David Michael, Webb, Gary Edward
• Primary Examiner(s): Aychillhum, Andargie M
• Application Number:
  US16/102,356
• Publication Number:
  US 20180352647A1
• Time in Patent Office: 393 Days
• Field of Search: 361777
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H05K 1/0243 Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 1/0245 Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• CPC Class Codes: H05K 1/029 having a programmable lay-out, i.e. adapted for choosing between a few possibilities
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10212 Programmable component
• CPC Class Codes: H05K 2201/10719 Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

A printed circuit board assembly includes a printed circuit board having a plurality of signal lanes. The PCBA also includes at least one application-specific integrated circuit operatively mounted to the printed circuit board and connected with the plurality of signal lanes. The PCBA includes a first configuration element operatively mounted to the printed circuit board in a first orientation and at a first location and having a first bridging element for providing an electrical connection between at least a first pair of signal lanes selected from the plurality of signal lanes. The first configuration element also includes a second bridging element so that if the first configuration element were operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board, the second bridging element would provide an electrical connection between at least a second pair of signal lanes.

Claims

1. An apparatus comprising:

a configuration module configured for operative mounting to a printed circuit board in a first orientation and at a first location and having a first bridging element for providing electrical connection between at least a first pair of signal lanes selected from a plurality of signal lanes, the configuration module also including a second bridging element configured to provide electrical connection between at least a second pair of signal lanes selected from the plurality of signal lanes when the configuration module is operatively mounted to the printed circuit board in a different, second orientation relative to the printed circuit board.

2. The apparatus of claim 1, wherein the second orientation is orthogonal to the first orientation.

3. The apparatus of claim 1, further comprising a second configuration module configured for operative mounting to the printed circuit board, the second configuration module including a third bridging element configured to provide electrical connection between the second pair of signal lanes selected from the plurality of signal lanes when the configuration module is operatively mounted to the printed circuit board.

4. The apparatus of claim 1, wherein the second orientation is located on the opposing side of the configuration module compared to the first orientation.

5. The apparatus of claim 1, wherein the configuration module comprises six contact point groups.

6. The apparatus of claim 1, wherein the configuration module comprises a rectangular shape.

7. A method of configuring a printed circuit board assembly, comprising:

determining a first signal lane routing arrangement of a printed circuit board assembly associated with a plurality of components and a plurality of signal lanes, as the first signal lane routing arrangement relates to the plurality of components;

determining a desired printed circuit board assembly configuration including a second signal lane routing arrangement that includes selecting at least one signal lane for connecting the plurality of components;

comparing the first signal lane routing arrangement with the desired printed circuit board assembly configuration; and

providing at least one primarily passive configuration element having at least one bridging element that is configured to adjust a number of signal lanes connecting each of the plurality of components based on the first signal lane routing arrangement and the desired printed circuit board assembly configuration.

8. The method of claim 7, wherein signal lanes comprise one of:

transmission, receiving, or ground connections.

9. The method of claim 7, further comprising:

mounting the configuration element to the printed circuit board assembly such that the plurality of components are connected by the at least one bridging element.

10. The method of claim 7, wherein the plurality of components include at least one active component.

11. The method of claim 10, wherein the plurality of components includes one or more of:

semiconductor components, multiplexing components, de-multiplexing components or interface switches.

12. The method of claim 7, wherein the comparing the first signal lane routing arrangement with the desired printed circuit board assembly configuration includes comparing the first signal lane routing arrangement with the second signal lane routing arrangement.

13. The method of claim 12, further comprising a third signal lane routing arrangement and the desired printed circuit board assembly configuration includes comparing the first and second signal lane routing arrangement with the third signal lane routing arrangement wherein the configuration element has more than one bridging element.

14. The method of claim 7, wherein the first signal lane routing arrangement includes a plurality of connections between the plurality of components.

15. An apparatus, comprising:

a printed circuit board assembly having a plurality of signal lanes; and

a repositionable, primarily passive configuration element having at least one bridging element, the configuration element configured to be rotatable and removable for selective mounting to the printed circuit board assembly in a first orientation, the configuration element having at least one bridging element that connects at least two signal lanes of the plurality of signal lanes when mounted to the printed circuit board assembly.

16. The apparatus of claim 15, wherein the configuration element is mounted to the printed circuit board assembly at a first location.

17. The apparatus of claim 15, wherein the configuration element is fully passive.

18. The apparatus of claim 15, wherein the configuration element requires a negligible or insubstantial amount of electric power for the configuration element itself to function.

19. A method comprising:

mounting a configuration element to a circuit board in a first orientation, the configuration element including a first and second set of bridging elements; and

electrically connecting the first set of bridging elements between a pair of signal lanes of the circuit board without electrically connecting the second set of bridging elements to any signal lanes of the circuit board.

20. The method of claim 19, further comprising:

remounting the configuration element to the circuit board in a second orientation; and

electrically connecting the second set of bridging elements between a different pair of signal lanes of the circuit board without electrically connecting the first set of bridging elements to any signal lanes of the circuit board.