Hall sensor mounting in an implantable blood pump

• US 10,413,650 B2
• Filed: 10/05/2016
• Issued: 09/17/2019
• Est. Priority Date: 08/31/2012
• Status: Active Grant

• Current Assignee: TC1 LLC (Abbott Laboratories Incorporated)
• Original Assignee: TC1 LLC (Abbott Laboratories Incorporated)
• Inventors: Schimpf, Samuel, McChrystal, Mark, Stark, III, Joseph C., Siebenhaar, Andre
• Primary Examiner(s): Layno, Carl H
• Assistant Examiner(s): Piateski, Erin M
• Application Number:
  US15/286,449
• Publication Number:
  US 20170065755A1
• Time in Patent Office: 1,077 Days
• Field of Search: 600 16
• CPC Class Codes: A61M 2205/3317 Electromagnetic, inductive or dielectric measuring means
• CPC Class Codes: A61M 2205/3334 Measuring or controlling the flow rate
• CPC Class Codes: A61M 2205/3365 Rotational speed
• CPC Class Codes: A61M 2207/00 Methods of manufacture, assembly or production
• CPC Class Codes: A61M 60/148 in line with a blood vessel using resection or like techniques, e.g. permanent endovascular heart assist devices
• CPC Class Codes: A61M 60/178 drawing blood from a ventricle and returning the blood to the arterial system via a cannula external to the ventricle, e.g. left or right ventricular assist devices
• CPC Class Codes: A61M 60/216 including a rotating member acting on the blood, e.g. impeller
• CPC Class Codes: A61M 60/419 the force acting on the blood contacting member being permanent magnetic, e.g. from a rotating magnetic coupling between driving and driven magnets
• CPC Class Codes: A61M 60/422 the force acting on the blood contacting member being electromagnetic, e.g. using canned motor pumps
• CPC Class Codes: A61M 60/515 Regulation using real-time patient data
• CPC Class Codes: A61M 60/538 Regulation using real-time blood pump operational parameter data, e.g. motor current
• CPC Class Codes: A61M 60/824 Hydrodynamic or fluid film bearings
• CPC Class Codes: F04D 13/064 Details of the magnetic circuit
• CPC Class Codes: F04D 15/0077 Safety measures F04D15/02 takes precedence
• CPC Class Codes: G01B 7/003 for measuring position, not involving coordinate determination coordinate measuring G01B7/004
• CPC Class Codes: G01B 7/30 for measuring angles or tapers; for testing the alignment of axes
• CPC Class Codes: G01D 5/142 using Hall-effect devices measuring magnetic variables using Hall-effect or other galvanomagnetic devices G01R33/06
• CPC Class Codes: G01R 33/072 Constructional adaptation of the sensor to specific applications
• CPC Class Codes: H05K 1/028 Bending or folding regions of flexible printed circuits H05K1/0283 takes precedence
• CPC Class Codes: H05K 1/119 Details of rigid insulating substrates therefor, e.g. three-dimensional details H05K1/117 takes precedence
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/052 : Branched
• CPC Class Codes: H05K 2201/10151 : Sensor
• CPC Class Codes: H05K 3/30 : Assembling printed circuits with electric components, e.g. with resistor
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: H05K 3/4691 : Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
• CPC Class Codes: Y10T 29/49009 : Dynamoelectric machine
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base

Abstract

A molded interconnect device can carry a Hall sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.

Claims

1. A sensor mount assembly for insertion into a blood pump assembly, the sensor mount assembly comprising:

a printed circuit board having rigid and flexible portions, wherein the printed circuit board comprises a flexible ring-shaped outer portion with one or more extension portions projecting inwardly from the outer portion;

sensors having rigid material attached thereto; and

a rigid carrier for supporting the printed circuit board and the sensors, the carrier having rigid guide rails configured to locate the rigid material attached to the sensors.

2. The sensor mount assembly of claim 1, wherein the rigid guide rails comprise slots that receive the rigid material attached to the sensors.

3. The sensor mount assembly of claim 2, wherein the rigid portion of the printed circuit board comprises a breakaway tab configured to be detached from the printed circuit board after the rigid material is received in the slots of the rigid guide rails.

4. The sensor mount assembly of claim 3, wherein the rigid portion of the printed circuit board comprises scoring marks that allow the breakaway tab to be detached from the printed circuit board.

5. The sensor mount assembly of claim 2, wherein the sensors are arranged axi-symmetrically on the carrier when the rigid material attached to each of the sensors is received in the slots of the rigid guide rails.

6. The sensor mount assembly of claim 1, wherein the rigid material attached to the sensors is attached to top edges of the sensors.

7. The sensor mount assembly of claim 1, wherein the rigid material attached to the sensors comprises electrically neutral material.

8. The sensor mount assembly of claim 7, wherein the electrically neutral material is masked with a static dissipative coating.

9. The sensor mount assembly of claim 1, wherein the rigid material attached to each of the sensors is connected to a respective extension portion of the printed circuit board.

10. The sensor mount assembly of claim 1, wherein the sensor mount assembly is configured to be inserted into an implantable blood pump assembly.

11. The sensor mount assembly of claim 10, wherein the sensors are configured to transduce a position of a rotor of the implantable blood pump.

12. The sensor mount assembly of claim 1, wherein the sensors are Hall sensors.

13. The sensor mount assembly of claim 1, wherein the rigid material attached to each of one or more of the sensors extends transversely across at least two of the rigid guide rails.

14. The sensor mount assembly of claim 1, wherein the rigid portion of the printed circuit board comprises a portion at an end of each of one or more of the extension portions that is configured to receive one of the sensors.