Microchip manufactured with thermocompression
First Claim
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1. A micro fluidic device comprising:
- at least two substrates each comprising a thermoplastic resin;
a space provided in at least one of the substrates;
at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space,wherein the at least one member is fixed within the space by at least one wall surface that is thermally deformed by thermocompression; and
a flow path formed between the at least two substrates,wherein at least a portion of the flow path is formed by the at least one member.
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Abstract
There is provided a microchip including at least two substrates each comprising a thermoplastic resin, and at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin, the at least one member including at least one engagement end including a protrusion extending between the at least two substrates, wherein the at least one member is fixed to the at least two substrates by the protrusion being held between the at least two substrates by at least one wall surface that is thermally deformed by thermocompression.
12 Citations
20 Claims
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1. A micro fluidic device comprising:
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at least two substrates each comprising a thermoplastic resin; a space provided in at least one of the substrates; at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space, wherein the at least one member is fixed within the space by at least one wall surface that is thermally deformed by thermocompression; and a flow path formed between the at least two substrates, wherein at least a portion of the flow path is formed by the at least one member. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19)
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20. A manufacturing method for a micro fluidic device comprising:
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arranging at least two substrates which are made of thermoplastic resin and which have a space that is formed in at least one of the substrates; inserting, into the space, at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin; and fixing the at least one member within the space by at least one wall surface that is thermally deformed by thermocompression; and forming a flow path between the at least two substrates, wherein at least a portion of the flow path is formed by the at least one member.
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Specification