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Microchip manufactured with thermocompression

  • US 10,414,118 B2
  • Filed: 02/28/2017
  • Issued: 09/17/2019
  • Est. Priority Date: 07/20/2011
  • Status: Active Grant
First Claim
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1. A micro fluidic device comprising:

  • at least two substrates each comprising a thermoplastic resin;

    a space provided in at least one of the substrates;

    at least one member comprising a material having a heat distortion temperature higher than a heat distortion temperature of the thermoplastic resin and which is provided in the space,wherein the at least one member is fixed within the space by at least one wall surface that is thermally deformed by thermocompression; and

    a flow path formed between the at least two substrates,wherein at least a portion of the flow path is formed by the at least one member.

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