Current sensor and a method of manufacturing a current sensor
First Claim
1. A current sensor comprising:
- a first board portion supporting a first current sensing coil, the first current sensing coil formed around an opening in the first board portion using one or more planes, a first compensation wire formed on a second board portion, the first compensation wire formed around an opening in the second board portion and defining a single plane; and
wherein the first board portion is stacked with the second board portion such that their respective openings are aligned, the openings are arranged to receive a current carrying conductor, and the board portions are arranged such that the first current sensing coil and the compensation wire at least partially overlap.
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Accused Products
Abstract
The present disclosure provides an improved Rogowski-type current sensor. In order to allow the sensing coil and the compensation wire to overlap, the sensor is produced using two boards. The current sensing coil is provided on one board, and the compensation wire is provided on another board. The coil and the wire are arranged such that they at least partially overlap, and ideally the compensation wire is formed entirely within the area defined by the coil, albeit in a different plane. This arrangement makes the current sensor far better at rejecting interference than prior art PCB arrangements. In addition, the coil may be formed on a two-sided board. The board has upper radial elements formed on an upper surface, and lower radial elements formed on lower surface. The radial elements are connected using vias formed in the board. The upper radial elements are arranged in a first plane, and the lower radial elements are formed in a second parallel plane. The upper radial elements are arranged so that they are aligned with the lower radial elements, such that a pair of radial elements form a radial plane that is perpendicular to the board surface. This symmetry ensures excellent sensitivity to currents in a conductor.
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Citations
20 Claims
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1. A current sensor comprising:
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a first board portion supporting a first current sensing coil, the first current sensing coil formed around an opening in the first board portion using one or more planes, a first compensation wire formed on a second board portion, the first compensation wire formed around an opening in the second board portion and defining a single plane; and wherein the first board portion is stacked with the second board portion such that their respective openings are aligned, the openings are arranged to receive a current carrying conductor, and the board portions are arranged such that the first current sensing coil and the compensation wire at least partially overlap. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a current sensor;
- comprising;
providing a first board having an opening formed therein; forming a first current sensing coil on the first board around the opening in the first board; providing a second board having an opening formed therein; forming a first compensation wire on a single, first surface of the second board around the opening in the second board; attaching the first board to the second board such that that the respective openings are aligned; wherein the openings are arranged to receive a current carrying conductor, and the boards are arranged such that the first current sensing coil and the first compensation wire at least partially overlap. - View Dependent Claims (13, 14)
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15. A current sensor comprising:
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a first board supporting a first current sensing coil, the first current sensing coil formed around an opening in the first board; a second board; a first compensation wire formed on a first surface of the second board, the first compensation wire formed around an opening in the second board; a third board supporting a second current sensing coil, the second current sensing coil formed around an opening in the third board; a second compensation wire formed on a second surface of the second board, the second compensation wire formed around the opening in the second board, wherein the first board is attached to the second board such that their respective openings are aligned, wherein the openings of the first board and the second board arranged to receive a current carrying conductor, and arranged such that the first current sensing coil and the compensation wire at least partially overlap; wherein the third board is attached to the second board such that their respective openings are aligned, the openings of the second board and the third board arranged to receive a current carrying conductor, and arranged such that the second current sensing coil and the second compensation wire at least partially overlap; and wherein the first and second current sensing coils are coupled together to produce a differential output. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification