Ultra-sensitive, ultra-low power RF field sensor
First Claim
1. A low power sensor, comprising:
- a hollow enclosure;
an antenna disposed external to said hollow enclosure and configured to collect emission of electromagnetic energy;
a circuit disposed within said hollow enclosure and comprising a low noise amplifier (LNA) connectable to said antenna, and an analog to digital converter (ADC) in a connection with said LNA;
circuit connections connecting, during use of said sensor, said circuit to each of said antenna, a source of electric energy and a signal processing component;
a connection between said hollow enclosure and an enclosure of an integrated circuit (IC), said connection comprises an adhesive layer disposed on an exterior surface of said hollow enclosure, said antenna being encapsulated in said adhesive layer, whereby said antenna is disposed between said sensor and the IC during use of said sensor; and
said sensor configured to at least measure a low-level electromagnetic energy emitted from the IC.
1 Assignment
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Accused Products
Abstract
A sensor includes a hollow enclosure, an antenna disposed external to the hollow enclosure and configured to collect emission of electromagnetic energy, a circuit disposed within the hollow enclosure and comprising a low noise amplifier (LNA) connectable to the antenna, and an analog to digital converter (ADC) in a connection with the LNA, circuit connections connecting, during use of the sensor, the circuit to each of the antenna, a source of electric energy and a signal processing component, a connection between the enclosure and an enclosure of an integrated circuit (IC), whereby the antenna id disposed between the sensor and the IC, and the sensor configured to at least measure a low-level electromagnetic energy emitted from the IC.
24 Citations
17 Claims
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1. A low power sensor, comprising:
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a hollow enclosure; an antenna disposed external to said hollow enclosure and configured to collect emission of electromagnetic energy; a circuit disposed within said hollow enclosure and comprising a low noise amplifier (LNA) connectable to said antenna, and an analog to digital converter (ADC) in a connection with said LNA; circuit connections connecting, during use of said sensor, said circuit to each of said antenna, a source of electric energy and a signal processing component; a connection between said hollow enclosure and an enclosure of an integrated circuit (IC), said connection comprises an adhesive layer disposed on an exterior surface of said hollow enclosure, said antenna being encapsulated in said adhesive layer, whereby said antenna is disposed between said sensor and the IC during use of said sensor; and said sensor configured to at least measure a low-level electromagnetic energy emitted from the IC. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An integrated circuit comprising:
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a first hollow enclosure; a die disposed within said first hollow enclosure; circuit(s) disposed on said die; pins electrically coupled to said circuit(s) and extending outwardly from edge(s) of said first hollow enclosure; a sensor configured to at least measure and process a low-level electromagnetic energy emitted from said circuit(s) when said circuit(s) is(are) being at least coupled to a source of electric energy, said senor defining a second hollow enclosure; an antenna disposed between exterior surfaces of said first and second hollow enclosures, said antenna coupled to said sensor and configured to collect the emission of the low-level electromagnetic energy emitted from said circuit(s); and a mechanical connection between said first and second hollow enclosures, said mechanical connection comprises a layer of an adhesive material, said antenna being encapsulated within said layer of adhesive material.
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16. A sensor configured to collect and process emissions of electromagnetic energy from an integrated circuit (IC), comprising:
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an antenna configured to collect said emissions of electromagnetic energy; a low noise amplifier (LNA) connectable to said antenna; an analog-to-digital converter (ADC) coupled to said LNA, said ADC converts a frequency signal from said LNA in an analog form to a frequency signal in a digital form; a signal processing component configured to process said frequency signal in said digital form; an energy harvesting source coupled to said LNA; a power management module coupled to each of said LNA and said ADC; an enclosure, each of said LNA, said ADC, said signal processing component and said power management module disposed within said enclosure; and a layer of an adhesive material on an exterior surface of said enclosure, said antenna being encapsulated within said layer of adhesive material; said antenna being disposed between said enclosure and an enclosure of the IC during use of said sensor. - View Dependent Claims (17)
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Specification