Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance

• US 10,418,331 B2
• Filed: 01/05/2018
• Issued: 09/17/2019
• Est. Priority Date: 11/23/2010
• Status: Active Grant

• Current Assignee: X Display Company Technology Limited (Sensinnovat BVBA)
• Original Assignee: X-Celeprint Limited
• Inventors: Bower, Christopher
• Primary Examiner(s): Tran, Tan N
• Application Number:
  US15/863,164
• Publication Number:
  US 20180130751A1
• Time in Patent Office: 620 Days
• Field of Search: 257 48
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 2221/68368 used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
• CPC Class Codes: H01L 2221/68372 used to support a device or wafer when forming electrical connections thereto when forming bonding pads H01L24/03; when forming bump connectors H01L24/11; when forming layer connectors H01L24/27
• CPC Class Codes: H01L 2224/21 of an individual HDI interconnect
• CPC Class Codes: H01L 2224/2101 Structure
• CPC Class Codes: H01L 2224/2105 Shape
• CPC Class Codes: H01L 2224/211 Disposition
• CPC Class Codes: H01L 2224/214 Connecting portions
• CPC Class Codes: H01L 2224/24011 Deposited, e.g. MCM-D type
• CPC Class Codes: H01L 2224/2405 Shape
• CPC Class Codes: H01L 2224/24101 Connecting bonding areas at the same height
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/244 Connecting portions
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/82106 by subtractive methods
• CPC Class Codes: H01L 2224/83 using a layer connector
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/5389 : the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 24/19 : Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/20 : Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/24 : of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15788 : Glasses, e.g. amorphous oxides, nitrides or fluorides

Abstract

An electronic component array includes a backplane substrate, and a plurality of integrated circuit elements on the backplane substrate. Each of the integrated circuit elements includes a chiplet substrate having a connection pad and a conductor element on a surface thereof. The connection pad and the conductor element are electrically separated by an insulating layer that exposes at least a portion of the connection pad. At least one of the integrated circuit elements is misaligned on the backplane substrate relative to a desired position thereon. A plurality of conductive wires are provided on the backplane substrate including the integrated circuit elements thereon, and the connection pad of each of the integrated circuit elements is electrically connected to a respective one of the conductive wires notwithstanding the misalignment of the at least one of the integrated circuit elements. Related fabrication methods are also discussed.

Claims

1. An electronic component array, comprising:

a backplane substrate;

a plurality of integrated circuit elements disposed on the backplane substrate, each of the integrated circuit elements comprising a chiplet substrate, a connection pad disposed on a surface of the chiplet substrate, and a conductor element disposed on the surface of the chiplet substrate, wherein the connection pad and the conductor element are physically and electrically separated by an insulating layer that exposes at least a portion of the connection pad and is in contact with and covers the conductor element, and wherein at least one of the integrated circuit elements is misaligned on the backplane substrate relative to a desired position thereon at a distance from the desired position that is greater than or equal to a distance between the conductor element and the connection pad; and

a plurality of conductive wires on the backplane substrate that each extend over and in contact with the insulating layer, wherein the connection pad of each of the plurality of integrated circuit elements is electrically connected to a respective one of the conductive wires and the conductor element is insulated from each of the plurality of conductive wires by the insulating layer, notwithstanding that the at least one of the integrated circuit elements is misaligned on the backplane substrate.

2. The array of claim 1, further comprising an adhesive layer between the chiplet substrate of each of the plurality of integrated circuit elements and the backplane substrate, wherein the adhesive layer adheres the chiplet substrate of each of the plurality of integrated circuit elements to the backplane substrate.

3. The array of claim 1, further comprising a planarization layer comprising via openings disposed on the backplane substrate, and wherein each of the conductive wires extends into a respective via opening such that the conductive wires electrically contact the connection pad of each of the integrated circuit elements.

4. The array of claim 3, wherein respective positions of the via openings in the planarization layer are based on respective desired positions of the integrated circuit elements on the backplane substrate, and wherein at least one of the via openings exposes a portion of the connection pad and a portion of the insulating layer covering the conductor element of the at least one of the integrated circuit element that is misaligned on the receiving substrate.

5. The array of claim 4, wherein the exposed portion of the connection pad is smaller than a dimension of the at least one via opening.

6. The array of claim 1, wherein the connection pad of each of the plurality of integrated circuit elements is coupled to an active element therein, wherein the conductive wires provide an electrical connection between respective active elements of each chiplet substrate, and wherein the conductor element of each of the integrated circuit elements provides an electrical connection between respective active elements of a same chiplet substrate.

7. The array of claim 6, wherein each chiplet substrate of the plurality of integrated circuit elements comprises a plurality of connection pads and a plurality of conductor elements, and wherein at least one of the plurality of conductor elements is disposed between adjacent ones of the plurality of connection pads on the surface of the chiplet substrate.

8. The array of claim 1, wherein the plurality of integrated circuit elements comprise transfer-printed elements each comprising a broken tether.

9. The array of claim 1, wherein, for each of the plurality of integrated circuit elements, the conductor element and the connection pad on the chiplet substrate are portions of a same metal layer.

10. A structure for printing transferrable integrated circuit chiplets, comprising:

a source substrate;

a patterned sacrificial layer on the source substrate; and

a plurality of integrated circuit chiplets disposed on the patterned sacrificial layer, wherein each of the plurality of integrated circuit chiplets comprises;

a separate chiplet substrate detached from the source substrate by a pattern of the sacrificial layer;

a tether connecting the separate chiplet substrate to an anchor disposed on the source substrate;

active elements disposed on or in the chiplet substrate;

a connection pad disposed on a surface of the chiplet substrate;

chiplet wires disposed on or in the chiplet substrate electrically connecting the active elements and the connection pad;

a conductor element physically and electrically separate from the connection pad disposed on the surface of the chiplet substrate, the conductor element electrically connected to at least one of a chiplet wire and one of the active elements; and

an insulating layer disposed on the chiplet substrate and the conductor element, the insulating layer (i) leaving at least a portion of the connection pad exposed and (ii) in contact with and covering the conductor element.

11. The structure of claim 10, further comprising one or more exposed electrical test pads, each disposed in an anchor, wherein the tethers are electrically conductive tethers, each anchor is located over and in contact with the patterned sacrificial layer and has an electrically conductive tether connecting the anchor to one of the plurality of integrated circuit chiplets and one or more of the one or more exposed electrical test pads disposed in the anchor, and wherein the tethers electrically connect active elements in the one of the plurality of integrated circuit chiplets to the one or more of the one or more exposed electrical test pads disposed in the anchor.

12. A structure for printing transferrable integrated circuit chiplets, comprising:

a substrate;

a patterned sacrificial layer on the substrate; and

a plurality of integrated circuit chiplets disposed on the patterned sacrificial layer, wherein each of the plurality of integrated circuit chiplets comprises;

a separate chiplet substrate detached from the substrate by a pattern of the sacrificial layer;

active elements disposed on or in the chiplet substrate;

a connection pad disposed on a surface of the chiplet substrate;

chiplet wires disposed on or in the chiplet substrate electrically connecting the active elements and the connection pad;

a conductor electrically-separate from the connection pad on the surface of the chiplet substrate, the conductor electrically connected to at least one of a chiplet wire and one of the active elements; and

an insulating layer disposed on the chiplet substrate and the conductor, the insulating layer leaving at least a portion of the connection pad exposed, and

further comprising one or more exposed electrical test pads, a plurality of electrically conductive tethers, and anchors disposed on the substrate, each anchor located over and in contact with the patterned sacrificial layer and having a tether of the plurality of electrically conductive tethers connecting the anchor to one of the plurality of integrated circuit chiplets and one or more of the one or more exposed electrical test pads disposed in the anchor, wherein the tether electrically connects active elements in the one of the plurality of integrated circuit chiplets to the one or more exposed electrical test pads disposed in the anchor.