LED packaging material and manufacturing method of the same

• US 10,418,531 B2
• Filed: 06/09/2017
• Issued: 09/17/2019
• Est. Priority Date: 05/12/2017
• Status: Active Grant

• Current Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Original Assignee: Shenzhen China Star Optoelectronics Technology Co., Ltd. (TCL Technology Group Corp.)
• Inventors: Wang, Haijun
• Primary Examiner(s): Choi, Calvin Y
• Application Number:
  US15/737,159
• Publication Number:
  US 20180366624A1
• Time in Patent Office: 830 Days
• Field of Search: None
• CPC Class Codes: C08K 3/04 Carbon
• CPC Class Codes: C08K 9/04 Ingredients treated with organic substances treated with macromolecular compounds C08K9/08
• CPC Class Codes: C08L 101/00 Compositions of unspecified macromolecular compounds
• CPC Class Codes: C08L 2201/08 Stabilised against heat, light or radiation or oxydation
• CPC Class Codes: C08L 2203/206 use in coating or encapsulating of electronic parts
• CPC Class Codes: H01L 33/005 Processes
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

The present invention provides a light-emitting diode (LED) packaging material, which is formed by compounding the graphene with the silane or the epoxy resin, to improve the defects of manufacturing the LED packaging material of the single silane or the epoxy resin, with the help of the properties of graphene, so as to improve the performance of the LED packaging material. The present invention further provides a manufacturing method of a LED packaging material. The LED packaging material and the manufacturing method of the present invention, which is formed by compounding the graphene with the silane or the epoxy resin, to improve the defects of manufacturing the LED packaging material of the single silane or the epoxy resin, with the help of the properties of graphene, so as to improve the performance of the LED packaging material.

Claims

1. A manufacturing method of a light-emitting diode (LED) packaging material, which comprising:

mixing and heating a silane, a control agent, a basic ion exchange resin and a graphene with preset doses, to form a packaging material sample, wherein a mass percentage of the ion exchange resin is 5%-10%, a mass percentage of the graphene is 0.5%-2%, a molar ratio of the silane and the control agent is 1;

0.3-1;

1;

wherein the control agent comprises terminal hydroxyl groups; and

the basic ion exchange resin is a basic anion exchange resin or a basic cation exchange resin;

removing impurities in the packaging material sample, to obtain the LED packaging material.

2. The manufacturing method according to claim 1, wherein in the step of mixing and heating a silane, a control agent, a basic ion exchange resin and a graphene with preset doses, a heating temperature is 30-80°

C., a heating duration is 5-20 hours.

3. The manufacturing method according to claim 1, wherein the impurities in the packaging material sample comprises a residual the basic ion exchange resin left by insufficient reaction, and the residual basic ion exchange resin can be removed by filtration.

4. The manufacturing method according to claim 1, wherein the impurities in the packaging material sample further comprises a low boiling point solvent, and the low boiling point solvent can be removed by depressurization.