Sensor connections
First Claim
1. A sensor transmitter assembly comprising:
- a sensor assembly comprising a sensor module wherein a first sensor including a first sensor head having at least one first sensor contact pad is combined with a second sensor including a second sensor head having at least one second sensor contact pad;
wherein the first sensor head further comprises at least one conducting pad integrated thereon;
wherein the first sensor and the second sensor are interlaced, wherein a distal end of the first sensor is on top and the second sensor head is on bottom such that the second sensor contact pad is placed against the at least one conducting pad integrated on the first sensor; and
a transmitter assembly positioned on a top of the sensor assembly to form a single unit, the transmitter assembly having at least one transmitter contact disposed on a base of the transmitter assembly, wherein the at least one first sensor contact pad and the at least one second sensor form a connection path with the at least one transmitter contact.
1 Assignment
0 Petitions
Accused Products
Abstract
This disclosure generally relates to medical devices that include a sensor transmitter assembly that includes a sensor assembly including a sensor module where a first sensor including a first sensor head having at least one first sensor contact pad is combined with a second sensor including a second sensor head having at least one second sensor contact pad. The sensor transmitter assembly also includes a transmitter assembly positioned on a top of the sensor assembly to form a single unit, the transmitter assembly having at least one transmitter contact disposed on a base of the transmitter assembly, where the first sensor contact pad(s) and the second sensor form a connection path with the transmitter contact(s).
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Citations
3 Claims
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1. A sensor transmitter assembly comprising:
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a sensor assembly comprising a sensor module wherein a first sensor including a first sensor head having at least one first sensor contact pad is combined with a second sensor including a second sensor head having at least one second sensor contact pad;
wherein the first sensor head further comprises at least one conducting pad integrated thereon;
wherein the first sensor and the second sensor are interlaced, wherein a distal end of the first sensor is on top and the second sensor head is on bottom such that the second sensor contact pad is placed against the at least one conducting pad integrated on the first sensor; anda transmitter assembly positioned on a top of the sensor assembly to form a single unit, the transmitter assembly having at least one transmitter contact disposed on a base of the transmitter assembly, wherein the at least one first sensor contact pad and the at least one second sensor form a connection path with the at least one transmitter contact. - View Dependent Claims (2, 3)
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Specification