Methods for determining resist deformation
First Claim
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1. A method comprising:
- obtaining at least a characteristic of deformation of a resist layer occurring in a first direction, as if there were no deformation occurring in any directions perpendicular to the first direction;
obtaining at least a characteristic of deformation of the resist layer occurring in a second direction as if there were no deformation occurring in the first direction, the second direction being different from the first direction; and
obtaining, by a hardware computer system, at least a characteristic of three-dimensional deformation of the resist layer based on the characteristic of the deformation occurring in the first direction and the characteristic of the deformation occurring in the second direction.
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Abstract
A method including: obtaining at least a characteristic of deformation of a resist layer in a first direction, as if there were no deformation in any directions perpendicular to the first direction; obtaining at least a characteristic of deformation of the resist layer in a second direction as if there were no deformation in the first direction, the second direction being perpendicular different to from the first direction; and obtaining at least a characteristic of three-dimensional deformation of the resist layer based on the characteristic of the deformation in the first direction and the characteristic of the deformation in the second direction.
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Citations
20 Claims
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1. A method comprising:
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obtaining at least a characteristic of deformation of a resist layer occurring in a first direction, as if there were no deformation occurring in any directions perpendicular to the first direction; obtaining at least a characteristic of deformation of the resist layer occurring in a second direction as if there were no deformation occurring in the first direction, the second direction being different from the first direction; and obtaining, by a hardware computer system, at least a characteristic of three-dimensional deformation of the resist layer based on the characteristic of the deformation occurring in the first direction and the characteristic of the deformation occurring in the second direction. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for improving a lithographic process for creating-a portion of a design layout on a substrate using a lithographic apparatus, the method comprising:
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computing, by a hardware computer system, a multi-variable cost function, the multi-variable cost function being a function of at least a characteristic of deformation of a resist layer on the substrate and a plurality of design variables that are characteristics of the lithographic process; and reconfiguring one or more of the characteristics of the lithographic process by adjusting one or more of the design variables and re-computing the multi-variable cost function until a certain termination condition is satisfied. - View Dependent Claims (15, 16, 17)
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18. A non-transitory computer readable-medium comprising instructions configured to cause a computer system to:
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obtain at least a characteristic of deformation of a resist layer occurring in a first direction, as if there were no deformation occurring in any directions perpendicular to the first direction; obtain at least a characteristic of deformation of the resist layer occurring in a second direction as if there were no deformation occurring in the first direction, the second direction being different from the first direction; and obtain at least a characteristic of three-dimensional deformation of the resist layer based on the characteristic of the deformation occurring in the first direction and the characteristic of the deformation occurring in the second direction. - View Dependent Claims (19, 20)
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Specification