Semiconductor package floating metal checks
First Claim
1. A computer-implemented method for checking floating metals in a laminate structure, the method comprising:
- receiving, by a processor, floating metal rules and a semiconductor package design comprising a plurality of laminate layers, the laminate layers each comprising a plurality of metal shapes, a plurality of signal lines, and a plurality of vias;
mapping each of the plurality of metal shapes, the plurality of signal lines, and the plurality of vias to one or more cells in an array, wherein each cell in the array comprises a number and each digit in the number corresponds to a unique location on a laminate layer in the semiconductor package design; and
determining, for each of the one or more cells comprising at least one of the plurality of metal shapes, whether the plurality of vias satisfies the floating metal rules.
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Accused Products
Abstract
Embodiments of the invention include methods, systems, and computer program products for checking floating metals in a laminate structure. Aspects of the invention include receiving, by a processor, floating metal rules and a semiconductor package design having a plurality of laminate layers. Each laminate layer includes a plurality of metal shapes, a plurality of signal lines, and a plurality of vias. The metal shapes, signal lines, and vias are mapped to one or more cells in an array. The processor determines, for each cell corresponding to a metal shape, whether the plurality of vias satisfies the floating metal rules. The processor can suggest new vias to satisfy the floating metal rules.
36 Citations
20 Claims
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1. A computer-implemented method for checking floating metals in a laminate structure, the method comprising:
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receiving, by a processor, floating metal rules and a semiconductor package design comprising a plurality of laminate layers, the laminate layers each comprising a plurality of metal shapes, a plurality of signal lines, and a plurality of vias; mapping each of the plurality of metal shapes, the plurality of signal lines, and the plurality of vias to one or more cells in an array, wherein each cell in the array comprises a number and each digit in the number corresponds to a unique location on a laminate layer in the semiconductor package design; and determining, for each of the one or more cells comprising at least one of the plurality of metal shapes, whether the plurality of vias satisfies the floating metal rules. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A system for checking floating metals in a laminate structure, the system having a processor coupled to a memory, the processor configured to:
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receive floating metal rules and a semiconductor package design comprising a plurality of laminate layers, the laminate layers each comprising a plurality of metal shapes, a plurality of signal lines, and a plurality of vias; map each of the plurality of metal shapes, the plurality of signal lines, and the plurality of vias to one or more cells in an array, wherein each cell in the array comprises a number and each digit in the number corresponds to a unique location on a laminate layer in the semiconductor package design; and determine, for each of the one or more cells comprising at least one of the plurality of metal shapes, whether the plurality of vias satisfies the floating metal rules. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A computer program product for checking floating metals in a laminate structure, the computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a processor to cause the processor to:
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receive floating metal rules and a semiconductor package design comprising a plurality of laminate layers, the laminate layers each comprising a plurality of metal shapes, a plurality of signal lines, and a plurality of vias; map each of the plurality of metal shapes, the plurality of signal lines, and the plurality of vias to one or more cells in an array, wherein each cell in the array comprises a number and each digit in the number corresponds to a unique location on a laminate layer in the semiconductor package design; and determine, for each of the one or more cells comprising at least one of the plurality of metal shapes, whether the plurality of vias satisfies the floating metal rules. - View Dependent Claims (17, 18, 19, 20)
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Specification