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Semiconductor package floating metal checks

  • US 10,423,751 B2
  • Filed: 09/29/2017
  • Issued: 09/24/2019
  • Est. Priority Date: 09/29/2017
  • Status: Active Grant
First Claim
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1. A computer-implemented method for checking floating metals in a laminate structure, the method comprising:

  • receiving, by a processor, floating metal rules and a semiconductor package design comprising a plurality of laminate layers, the laminate layers each comprising a plurality of metal shapes, a plurality of signal lines, and a plurality of vias;

    mapping each of the plurality of metal shapes, the plurality of signal lines, and the plurality of vias to one or more cells in an array, wherein each cell in the array comprises a number and each digit in the number corresponds to a unique location on a laminate layer in the semiconductor package design; and

    determining, for each of the one or more cells comprising at least one of the plurality of metal shapes, whether the plurality of vias satisfies the floating metal rules.

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