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Capacitive sensor packaging

  • US 10,423,815 B2
  • Filed: 05/21/2018
  • Issued: 09/24/2019
  • Est. Priority Date: 05/18/2012
  • Status: Active Grant
First Claim
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1. An assembly for an electronic device, comprising:

  • a device housing defining an opening;

    a fingerprint sensor;

    plastic molded above the fingerprint sensor, the plastic defining a button disposed to fit in the opening;

    a switch stacked vertically below the fingerprint sensor; and

    a button support plate attached to the device housing and positioned below the switch.

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