Component carrier and method for manufacturing the same
First Claim
1. A component carrier for carrying electronic components, the component carrier comprising:
- an at least partially electrically insulating core;
at least one electronic component embedded in the core; and
a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end;
wherein the at least one electronic component is electrically contacted directly to the component contacting end;
wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure;
wherein the wiring contacting end is electrically contacted directly to the wiring structure,wherein at least the exterior surface portion of the coupling structure comprises at least one of the group consisting of a pure resin, a palladium doped resin, a copper oxide doped resin, and a photoresist, a permanent resist,wherein the at least one through-connection comprises at least one pillar, at least one circular cylindrical pillar and/or a plurality of pillars aligned in parallel to one another.
1 Assignment
0 Petitions
Accused Products
Abstract
A component carrier including an electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end. The electronic component directly contacts the component contacting end. The wiring contacting end is directly electrically contacted to the wiring structure. The exterior surface portion of the coupling structure has homogeneous ablation properties and surface recesses filled with an electrically conductive wiring structure. A method includes embedding an electronic component in an electrically insulating core, providing a coupling structure with a conductive connection having a component end and a wiring end, connecting the electronic component directly to the component end, providing a surface portion of the coupling structure with homogeneous ablation properties, patterning the surface portion with recesses and filling the recesses with a wiring structure such that the wiring end is contacted directly.
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Citations
17 Claims
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1. A component carrier for carrying electronic components, the component carrier comprising:
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an at least partially electrically insulating core; at least one electronic component embedded in the core; and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end; wherein the at least one electronic component is electrically contacted directly to the component contacting end; wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure; wherein the wiring contacting end is electrically contacted directly to the wiring structure, wherein at least the exterior surface portion of the coupling structure comprises at least one of the group consisting of a pure resin, a palladium doped resin, a copper oxide doped resin, and a photoresist, a permanent resist, wherein the at least one through-connection comprises at least one pillar, at least one circular cylindrical pillar and/or a plurality of pillars aligned in parallel to one another. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a component carrier for carrying electronic components, the method comprising:
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embedding at least one electronic component in an at least partially electrically insulating core; providing a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and being formed with a component contacting end and a wiring contacting end; electrically contacting the at least one electronic component directly to the component contacting end; providing at least an exterior surface portion of the coupling structure with homogeneous ablation properties; patterning the exterior surface portion so as to form surface recesses; and filling the surface recesses with an electrically conductive wiring structure so that the wiring contacting end is electrically contacted directly to the wiring structure; the method further comprising; wherein the patterning and the filling directly electrically connect the wiring structure to at least one wiring contacting end of the at least one through-connection exposed by the patterning; wherein filling the surface recesses formed by the patterning is performed by an electroless deposition of electrically conductive material followed by a galvanic deposition of further electrically conductive material; and polishing at least the exposed surface portion of the coupling structure together with the exposed wiring structure by chemical mechanical polishing;
orthe method further comprising; attaching an electrically conductive mask layer and a photoresist layer on the exterior surface portion of the coupling structure; patterning the photoresist layer and the electrically conductive mask layer to thereby expose part of the exterior surface portion of the coupling structure; removing material of the exposed part of the exterior surface portion of the coupling structure to thereby expose at least part of the at least one wire contacting end by a laser treatment; filling the so formed surface recesses with electrically conductive material to thereby form the wiring structure by an electroless deposition procedure followed by a galvanic deposition procedure; removing the photoresist layer and the electrically conductive mask layer after the filling; not polishing an exposed surface after the filling by chemical mechanical polishing; and providing the at least one electronic component and at least part of the coupling structure as a monolithically integrated structure within a common semiconductor substrate. - View Dependent Claims (13, 14, 15)
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16. A component carrier for carrying electronic components, the component carrier comprising:
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an at least partially electrically insulating core; at least one electronic component embedded in the core; a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end; wherein the at least one electronic component is electrically contacted directly to the component contacting end; wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure; wherein the wiring contacting end is electrically contacted directly to the wiring structure, wherein the component carrier comprises at least one of the following features; the component carrier includes a combination of a coupling body and a coupling layer being arranged at least partially on the coupling body; an electric interface between the at least one electronic component and the at least one through-connection is free of a redistribution layer; and the at least one electronic component and at least part of the coupling structure are integrally formed in a semiconductor substrate.
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17. A component carrier for carrying electronic components, the component carrier comprising:
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an at least partially electrically insulating core; at least one electronic component embedded in the core; a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end; wherein the at least one electronic component is electrically contacted directly to the component contacting end; wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure; wherein the wiring contacting end is electrically contacted directly to the wiring structure, wherein dielectric material of the coupling structure comprises a matrix and filler particles embedded in the matrix, wherein the material of the matrix and of the filler particles together define the homogeneous ablation properties of the exterior surface portion of the coupling structure; wherein the filler particles are selected from a group consisting of beads, glass spheres, and organic fibres.
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Specification