×

Electronic device package

  • US 10,424,571 B2
  • Filed: 09/06/2017
  • Issued: 09/24/2019
  • Est. Priority Date: 12/30/2016
  • Status: Active Grant
First Claim
Patent Images

1. An electronic device package comprising:

  • a package substrate including a substrate body, and connection terminals disposed on a top surface of the substrate body;

    a processor;

    at least one high bandwidth memory;

    a power management integrated circuit;

    an intermediate structure including at least one interposer interposed between the package substrate and both the processor and the at least one high bandwidth memory and to which the processor and the at least one high bandwidth memory are mounted, each said at least one interposer including an interposer body and through-vias extending vertically through the interposer body and electrically connected to the connection terminals of the package substrate; and

    a passive electronic component, andwherein the processor is disposed on the intermediate structure and is electrically connected to the through-vias of the at least one interposer of the intermediate structure so as to be electrically connected to the connection terminals of the package substrate by the at least one interposer,the at least one high bandwidth memory is disposed on the intermediate structure beside the processor and is electrically connected to the processor by the intermediate structure,the passive electronic component is disposed on or within the interposer body of a corresponding interposer of the at least one interposer and is electrically connected to the power management integrated circuit,the power management integrated circuit is electrically connected to the processor by the intermediate structure, andthe passive electronic component comprises an inductor disposed immediately below the power management integrated circuit in the electronic device package.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×