Integrated circuit comprising at least an integrated antenna

• US 10,424,633 B2
• Filed: 08/02/2018
• Issued: 09/24/2019
• Est. Priority Date: 07/28/2011
• Status: Active Grant

• Current Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Original Assignee: STMicroelectronics SRL (STMicroelectronics NV)
• Inventors: Pagani, Alberto, Finocchiaro, Alessandro
• Primary Examiner(s): Roman, Angel
• Application Number:
  US16/052,777
• Publication Number:
  US 20180342574A1
• Time in Patent Office: 418 Days
• CPC Class Codes: G01R 31/2834 Automated test systems [ATE]; using microprocessors or computers G01R31/317 takes precedence; ATE for detection of defective computer hardware G06F11/2736
• CPC Class Codes: G01R 31/2889 Interfaces, e.g. between probe and tester G01R31/31905 and G01R1/07364 take precedence
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01L 22/32 Additional lead-in metallisation on a device or substrate, e.g. additional pads or pad portions, lines in the scribe line, sacrificed conductors arrangements for conducting electric current to or from the solid state body in operation H01L23/48
• CPC Class Codes: H01L 22/34 Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line switching, multiplexing, gating devices G01R19/25; process control with lithography, e.g. dose control, G03F7/20; structures for alignment control by optical means G03F7/70633
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05553 being rectangular
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/528 Geometry or layout of the interconnection structure H01L27/0207 takes precedence; algorithms G06F30/00
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 28/10 : Inductors
• CPC Class Codes: H01L 29/0642 : Isolation within the component, i.e. internal isolation
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/30107 : Inductance

Abstract

A probe card for integrated circuit testing includes a printed circuit support and a probe head having a first surface mounted to a surface of the printed circuit support. A flexible substrate is positioned adjacent to a second surface of the probe head and includes at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support. The flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test. The integrated circuit under test includes at least one conductive structure that extends in the peripheral portion on different planes of metallizations to form an integrated antenna that is coupled for communication and/or power transfer to the test antenna.

Claims

1. A probe card for integrated circuit testing, comprising:

a printed circuit support;

a probe head having a first surface mounted to a surface of the printed circuit support;

a flexible substrate positioned adjacent to a second surface of the probe head which is opposite the first surface, said flexible substrate including at least one flexible extension which extends beyond an edge of the probe head and includes a bend to make contact with the surface of the printed circuit support;

wherein the flexible substrate further includes a test antenna configured to support a wireless communications channel with an integrated circuit under test.

2. The probe card of claim 1, wherein the probe head includes a test probe extending from the second surface and configured to support a physical communications channel with the integrated circuit under test.

3. The probe card of claim 2, wherein the flexible substrate includes an opening and the test probe extends through the opening.

4. The probe card of claim 2, wherein the test probe has a magnetic feature.

5. The probe card of claim 4, wherein the magnetic feature is a covering of the test probe by a magnetic material.

6. The probe card of claim 4, wherein the magnetic feature is that the test probe is made of a magnetic and electrical material.

7. The probe card of claim 2, wherein the test antenna includes a winding and the wherein the test probe is located within the winding.

8. The probe card of claim 1, wherein the probe head includes a cavity at the second surface, and further comprising an integrated test circuit located within the cavity.

9. The probe card of claim 8, wherein the flexible substrate covers the cavity.

10. The probe card of claim 1, further comprising three-dimensional elements that form optically-recognizable fiducial markings present on a surface of the probe card which faces the integrated circuit under test.

11. The probe card of claim 1, further comprising automated test equipment (ATE) circuitry that is connected to the printed circuit support.

12. A probe card for integrated circuit testing, comprising:

a printed circuit support having a first surface and a second surface, wherein the second surface faces an integrated circuit under test;

wherein the printed circuit support includes a test antenna configured to support a wireless communications channel with the integrated circuit under test; and

three-dimensional elements extending from the second surface of the printed circuit support, said three-dimensional elements forming optically-recognizable fiducial markings which face the integrated circuit under test.

13. The probe card of claim 12, wherein the printed circuit support includes a magnetic material configured to support coupling of the test antenna to the integrated circuit under test.

14. The probe card of claim 12, wherein the test antenna includes a winding.

15. The probe card of claim 12, further comprising automated test equipment (ATE) circuitry that is connected to the printed circuit support.

16. A probe card for integrated circuit testing, comprising:

a probe head having a surface configured to face an integrated circuit under test, the probe head including a test probe extending from said surface and configured to support a physical communications channel with the integrated circuit under test; and

a flexible substrate positioned adjacent to said surface of the probe head said flexible substrate including at least one flexible extension which extends beyond an edge of the probe head to support making of an electrical connection;

wherein the flexible substrate further includes a test antenna configured to support a wireless communications channel with the integrated circuit under test.

17. The probe card of claim 16, wherein the flexible substrate includes an opening and the test probe extends through the opening.

18. The probe card of claim 16, wherein the test probe has a magnetic feature.

19. The probe card of claim 18, wherein the magnetic feature is a covering of the test probe by a magnetic material.

20. The probe card of claim 18, wherein the magnetic feature is that the test probe is made of a magnetic and electrical material.

21. The probe card of claim 16, wherein the test antenna includes a winding and wherein the test probe is located within the winding.

22. The probe card of claim 16, wherein the probe head includes a cavity at the second surface, and further comprising an integrated test circuit located within the cavity.

23. The probe card of claim 22, wherein the flexible substrate covers the cavity.

24. The probe card of claim 16, further comprising automated test equipment (ATE) circuitry that is connected to the test probe and test antenna.