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Super long channel device within VFET architecture

  • US 10,424,663 B2
  • Filed: 11/15/2017
  • Issued: 09/24/2019
  • Est. Priority Date: 05/23/2017
  • Status: Active Grant
First Claim
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1. A method for forming a semiconductor device, the method comprising:

  • forming a pair of semiconductor fins on a substrate;

    forming a semiconductor pillar between the semiconductor fins on the substrate;

    forming a bottom doped region that extends under all of the semiconductor fins and under part of the semiconductor pillar;

    recessing the semiconductor pillar below a surface of the semiconductor fins; and

    forming a conductive gate over a channel region of the semiconductor fins and the semiconductor pillar.

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