Method for producing optoelectronic conversion semiconductor chips and composite of conversion semiconductor chips

• US 10,424,698 B2
• Filed: 06/10/2016
• Issued: 09/24/2019
• Est. Priority Date: 06/12/2015
• Status: Active Grant

• Current Assignee: OSRAM OLED GMBH (Ams-Osram AG)
• Original Assignee: Osram Opto Semiconductors GmbH (Ams-Osram AG)
• Inventors: Leirer, Christian, Perzlmaier, Korbinian
• Primary Examiner(s): Taylor, Earl N
• Application Number:
  US15/735,945
• Publication Number:
  US 20180198037A1
• Time in Patent Office: 1,201 Days
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2933/0025 relating to coatings
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil

Abstract

A method for producing optoelectronic conversion semiconductor chips and a composite of conversion semiconductor chips are disclosed. In an embodiment the method includes growing a semiconductor layer sequence on a growth substrate, applying an electric contact on to a rear side of the semiconductor layer sequence facing away from the growth substrate, thinning the growth substrate, after thinning, cutting the growth substrate at least to the semiconductor layer sequence thereby forming a first intermediate space, applying a conversion layer on to the thinned growth substrate and singulating at least the thinned growth substrate and the semiconductor layer sequence.

Claims

1. A method for producing optoelectronic conversion semiconductor chips, the method comprising:

providing a growth substrate;

growing a semiconductor layer sequence on the growth substrate;

applying an electric contact to a rear side of the semiconductor layer sequence facing away from the growth substrate;

thinning the growth substrate;

after thinning, cutting the growth substrate and the semiconductor layer sequence to the electric contact, a dielectric or a metal layer thereby forming a second intermediate space, wherein the second intermediate space extends completely through the semiconductor layer sequence;

applying a conversion layer to the thinned growth substrate, wherein the conversion layer is arranged in the second intermediate space; and

singulating at least the thinned growth substrate and the semiconductor layer sequence for producing the optoelectronic conversion semiconductor chips.

2. The method according to claim 1, wherein applying the conversion layer comprising applying the conversion layer directly on to the thinned growth substrate, and wherein the conversion layer is configured to convert a primary radiation emitted by the semiconductor layer sequence at least partially into a secondary radiation different from the primary radiation.

3. The method according to claim 1, further comprising

after singulating, generating the optoelectronic conversion semiconductor chips having side flanks, which are at least partially covered with the conversion layer.

4. The method according to claim 1, further comprising:

after thinning, cutting the growth substrate, the semiconductor layer sequence and the electric contact, a dielectric or a metal layer thereby forming a third intermediate space, wherein the conversion layer is also arranged in the third intermediate space; and

after singulating, generating the optoelectronic conversion semiconductor chips having side flanks, which are covered completely with the conversion layer.

5. The method according to claim 4, wherein the conversion layer at the side flanks has a layer thickness of 20 μ

m to 400 μ

m.

6. The method according to claim 1, wherein applying the conversion layer comprises molding, spray-coating or potting.

7. The method according to claim 1, wherein the conversion layer is applied as a paste, granulate or a solution.

8. The method according to claim 1, wherein singulating comprises sawing, stealth-dicing, laser-dicing, laser-separation or scoring and breaking.

9. The method according to claim 1, wherein the method, after singulating, further comprises:

testing the optoelectronic conversion semiconductor chips; and

packaging of the optoelectronic conversion semiconductor chips.