Molded proximity sensor

• US 10,429,509 B2
• Filed: 03/31/2015
• Issued: 10/01/2019
• Est. Priority Date: 12/24/2014
• Status: Active Grant

• Current Assignee: Stmicroelectronics Pte Limited (STMicroelectronics NV)
• Original Assignee: Stmicroelectronics Pte Limited (STMicroelectronics NV)
• Inventors: Luan, Jing-En, Teysseyre, Jerome
• Primary Examiner(s): Epps, Georgia Y
• Assistant Examiner(s): Wyatt, Kevin
• Application Number:
  US14/674,650
• Publication Number:
  US 20160187483A1
• Time in Patent Office: 1,645 Days
• Field of Search: 25055938
• CPC Class Codes: G01S 17/04 Systems determining the presence of a target
• CPC Class Codes: G01S 7/4813 Housing arrangements
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/92227 the second connecting process involving a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 31/173 formed in, or on, a common substrate

Abstract

A proximity sensor includes a printed circuit board substrate, a semiconductor die, electrical connectors, a lens, a light emitting assembly, and an encapsulating layer. The semiconductor die is positioned over the printed circuit board substrate with its upper surface facing away from the printed circuit board substrate. Each of the electrical connectors is in electrical communication with a contact pad of the semiconductor die and a respective contact pad of the printed circuit board substrate. The lens is positioned over a sensor area of the semiconductor die. The light emitting assembly includes a light emitting device having a light emitting area, a lens positioned over the light emitting area, and contact pads facing the printed circuit board substrate. The encapsulating layer is positioned on the printed circuit board substrate, at least one of the electrical connectors, the semiconductor die, the lens, and the light emitting assembly.

Claims

1. A proximity sensor, comprising:

an encapsulating layer having a first side and a second side;

a plurality of cap feet in contact with and extending from the first side of the encapsulating layer, the plurality of cap feet and the encapsulating layer being formed from a same material, two of the cap feet having a first height with respect to the first side of the encapsulating layer, and one of the cap feet having a second height with respect to the first side of the encapsulating layer, the second height being different from the first height; and

a plurality of lenses, each of the lenses having a first side and a second side, the encapsulating layer in contact with the first side and the second side of each of the lenses;

a light emitting device disposed below a first one of the lenses;

a semiconductor die including a sensor area disposed below a second one of the lenses; and

an adhesive material, which prevents light from passing therethrough, that secures the one of the cap feet having the second height with respect to the first side of the encapsulating layer to the semiconductor die.

2. The proximity sensor of claim 1 wherein the encapsulating layer is at least partially disposed over each of the lenses.

3. The proximity sensor of claim 1 wherein each of the lenses is disposed between two of the cap feet.

4. The proximity sensor of claim 1 wherein one of the cap feet is disposed between the sensor area and the light emitting device and is secured to the semiconductor die.

5. The proximity sensor of claim 1 wherein the second side of the encapsulating layer includes a plurality of apertures, each of the lenses being disposed below one of the apertures.