High current, low equivalent series resistance printed circuit board coil for power transfer application
First Claim
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1. A device, comprising:
- a housing; and
a wireless charging coil, the coil including a layered structure of electric conductors on a printed circuit board (PCB), wherein the layered structure comprises;
a first layer including a first electrically conductive trace comprising a first turn and a second turn adjacent to the first turn;
a second layer including a second electrically conductive trace comprising a third turn and a fourth turn adjacent to the third turn; and
a plurality of vias coupling the first layer and the second layer, wherein the plurality of the vias include a first via, a second via and a third via distributed separately along a length of the first turn, each of the first via, the second via and the third via electrically connecting the first turn and the third turn, wherein the plurality of the vias further include a fourth via, a fifth via and sixth via distributed separately along a length of the second turn, each of the fourth via, fifth via and sixth via connecting the second turn and the fourth turn, wherein thickness of the device is less than 1 centimeter.
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Abstract
An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.
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Citations
17 Claims
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1. A device, comprising:
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a housing; and a wireless charging coil, the coil including a layered structure of electric conductors on a printed circuit board (PCB), wherein the layered structure comprises; a first layer including a first electrically conductive trace comprising a first turn and a second turn adjacent to the first turn; a second layer including a second electrically conductive trace comprising a third turn and a fourth turn adjacent to the third turn; and a plurality of vias coupling the first layer and the second layer, wherein the plurality of the vias include a first via, a second via and a third via distributed separately along a length of the first turn, each of the first via, the second via and the third via electrically connecting the first turn and the third turn, wherein the plurality of the vias further include a fourth via, a fifth via and sixth via distributed separately along a length of the second turn, each of the fourth via, fifth via and sixth via connecting the second turn and the fourth turn, wherein thickness of the device is less than 1 centimeter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification