Method for manufacturing electronic component with coil

• US 10,431,378 B2
• Filed: 04/16/2019
• Issued: 10/01/2019
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Sumida Corporation
• Original Assignee: Sumida Corporation
• Inventors: Sakamoto, Shinichi, Malcolm, Douglas James
• Primary Examiner(s): Nguyen, Tuyen T
• Application Number:
  US16/385,603
• Publication Number:
  US 20190244753A1
• Time in Patent Office: 168 Days
• Field of Search: 336 65, 336 83, 336 90, 336 92, 336 96, 336200, 336220-223, 336232-233
• CPC Class Codes: H01F 17/04 with magnetic core
• CPC Class Codes: H01F 2017/048 with encapsulating core, e.g. made of resin and magnetic powder
• CPC Class Codes: H01F 27/022 Encapsulation
• CPC Class Codes: H01F 27/24 Magnetic cores
• CPC Class Codes: H01F 27/255 made from particles H01F27/26 takes precedence
• CPC Class Codes: H01F 27/2828 Construction of conductive connections, of leads
• CPC Class Codes: H01F 27/29 Terminals; Tapping arrangements for signal inductances
• CPC Class Codes: H01F 41/02 for manufacturing cores, coils, or magnets H01F41/14 takes precedence; for dynamo-electric machines H02K15/00
• CPC Class Codes: H01F 41/0246 Manufacturing of magnetic circuits by moulding or by pressing powder magnetic cores made by moulding or by pressing powder H01F27/255; soft magnetic particles H01F1/20, H01F1/36
• CPC Class Codes: H01F 41/064 Winding non-flat conductive wires, e.g. rods, cables or cords
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49071 by winding or coiling

Abstract

A method for manufacturing an electronic component is provided. The method includes placing a T-shaped core and an air-core coil in a mold, placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold, and, after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

Claims

1. A method for manufacturing an electronic component comprising:

placing a T-shaped core and an air-core coil in a mold;

placing a mixture of a metal magnetic material and a thermosetting resin into the mold so as to embed the T-shaped core and the air-core coil in the mixture;

after placing the mixture, applying pressure in a range of 0.1 to 20.0 kg/cm2 to the placed mixture so that a shape of the placed mixture conforms to the T-shaped core, the air-core coil, and the mold; and

after applying the pressure, heating the mixture at a predetermined temperature for a predetermined time so that the placed mixture is hardened.

2. The method for manufacturing an electronic component according to claim 1,

wherein the predetermined temperature is in a range of 120 to 200°

C. and the predetermined time is in a range of 10 to 90 minutes.

3. The method for manufacturing an electronic component according to claim 1, further comprising:

winding a wire to form the air-core coil; and

preparing the T-shaped core separately from the forming the air-core coil,

wherein an inside diameter of the air-core coil is larger than an outside diameter of a core part of the T-shaped core.

4. The method for manufacturing an electronic component according to claim 3,

wherein a difference of the inside diameter of the air-core coil and the outside diameter of the core part of the T-shaped core is larger than a distance of at least two times a maximum particle in the mixture so that the mixture fills in a gap between the core part and the air-core coil.

5. The method for manufacturing an electronic component according to claim 1, further comprising:

simultaneously preparing the mixture, the T-shaped core, and the air-core coil,

wherein the metal magnetic material includes a Fe—

Si—

Cr alloy, and a viscosity of the mixture is in a range of 1,000 to 1,000,000 mPa·

s at room temperature.

6. The method for manufacturing an electronic component according to claim 5,

wherein a solvent is used for the preparing of the mixture.

7. The method for manufacturing an electronic component according to claim 1, further comprising:

dipping wire ends of the air-core coil in solder so that insulating layers on the wire ends of the air-core coil are removed and the solder adheres to the wire ends of the air-core coil; and

after the dipping, assembling the air-cored coil to the T-shaped core.

8. The method for manufacturing an electronic component according to claim 7, further comprising:

placing the air-core coil on a first surface of the T-shaped core during the assembling;

bending the end wires of the air-core coil at a side of the T-shaped core during the assembling; and

fixing ends of the end wires of the air-core coil to a second surface of the T-shaped core opposite the first surface during the assembling.

9. The method for manufacturing an electronic component according to claim 1,

wherein the mixture is supplied into the mold by a dispenser, and the dispenser includes:

a material tank in which the mixture is stored;

a cylinder;

a flow passage fluidly connected between the material tank and the cylinder;

a mixer disposed in the cylinder and configured to mix the mixture;

a valve disposed in the flow passage, the valve being configured to selectively supply the mixture from the material tank to the cylinder via the flow passage;

a valve driving member configured to drive the valve;

a piston movably disposed in the cylinder and configured to move the mixture in the cylinder; and

a discharge opening from which the mixture is supplied into the mold.

10. The method for manufacturing an electronic component according to claim 1,

wherein the pressure is applied in the range of 0.1 to 20.0 kg/cm2 to the placed mixture in the mold by a movable punch of a press machine.