Time-varying frequency powered heat source

• US 10,431,478 B2
• Filed: 11/26/2018
• Issued: 10/01/2019
• Est. Priority Date: 05/26/2016
• Status: Active Grant

• Current Assignee: Anand Deo
• Original Assignee: Anand Deo
• Inventors: Deo, Anand
• Primary Examiner(s): Van, Quang T
• Application Number:
  US16/200,120
• Publication Number:
  US 20190109024A1
• Time in Patent Office: 309 Days
• Field of Search: 219795, 219770, 219772, 219777, 21912136, 219201, 219690, 219691, 219696, 118795, 118770, 118772, 118777, 11812136, 118201, 118690, 118691, 118696, 438 9, 438660, 438710, 438 18, 15634551, 15634555
• CPC Class Codes: A61F 7/12 Devices for heating or cooling internal body cavities
• CPC Class Codes: H01L 21/324 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering H01L21/20 - H01L21/288 and H01L21/302 - H01L21/322 take precedence
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/67248 Temperature monitoring
• CPC Class Codes: H05B 1/023 Industrial applications
• CPC Class Codes: H05B 6/50 for monitoring or control

Abstract

A semiconductor or other substrate can include one or more electrodes, located directly or indirectly on the substrate, separated from each other and coupled to the substrate. At the two or more electrodes, non-zero frequency time-varying electrical energy can be received. The time-varying electrical energy can be coupled via the two or more electrodes to trigger a displacement current to activate free carriers confined within the semiconductor substrate to generate frequency-controlled heat in the semiconductor substrate.

Claims

1. An apparatus comprising:

an article of manufacture, comprising an active heat source including;

a predefined substrate; and

two or more electrodes, formed at manufacture to be located directly or indirectly on the substrate, the electrodes configured to receive a non-zero frequency time-varying electrical energy that is coupled by the one or more electrodes to the substrate to generate a frequency-controlled heat source in the substrate, the heat source location selected along a length of the two or more electrodes by adjusting the frequency of the time-varying electrical energy; and

wherein the two or more electrodes include first and second electrodes separated from each other by different minimum spacing at different locations on at least one of the first and second electrodes so that adjusting the frequency of the time-varying electrical energy is capable of selectably adjusting at least one corresponding frequency-dependent current path between the first and second electrodes to provide the frequency-controlled heat at at least one desired location in the substrate.

2. The apparatus of claim 1, wherein:

the substrate includes a semiconductor substrate; and

the two or more electrodes are capacitively coupled to the semiconductor substrate.

3. The apparatus of claim 1, comprising:

a temperature sensor, located in association with the substrate to sense a temperature associated with the substrate;

an electric field signal generator circuit, configured to generate the time-varying electrical energy; and

a control circuit, configured to use temperature information from the temperature sensor to establish or adjust at least one of;

(1) an amplitude of the time-varying electrical energy generated by the electric field signal generator;

(2) a frequency of the time-varying electrical energy generated by the electric field generator;

or

(3) a location or distribution of a current path between the first and second electrodes.

4. The apparatus of claim 1, wherein the two or more electrodes include first and second electric field nodes that include, at a first location on the semiconductor substrate, a spacing separating the first and second electrodes, wherein the spacing is specified to be less than or equal to a spacing capable of generating heat in the semiconductor substrate, without requiring net charge flow into or out of the semiconductor substrate via pass-through conduction current, in response to the time-varying electrical energy received at the first and second electrodes.

5. The apparatus of claim 1, wherein the two or more electrodes include electrically conductive material that is separated from the substrate by a dielectric layer.

6. The apparatus of claim 1, wherein the temperature of the substrate is adjusted by direct heating of the substrate by an electric field produced by the time-varying electrical energy, without requiring indirect heat coupling to the substrate via the dielectric.

7. The apparatus of claim 1, wherein an amplitude of the time-varying electrical energy received by the two or more electrodes is controlled using information about the temperature of the substrate to establish or adjust the temperature of the substrate.

8. The apparatus of claim 1, wherein a frequency of the time-varying electrical energy received by the electrodes is controlled using information about the temperature of the substrate to establish or adjust the temperature of the substrate.

9. The apparatus of claim 1, wherein the two or more electrodes include a first electrode that is located directly or indirectly on a first face of the semiconductor substrate and a second electrode that is located directly or indirectly an opposing second face of the semiconductor substrate.

10. The apparatus of claim 9, wherein the second electrode covers enough of the opposing second face of the semiconductor substrate to form a ground plane with respect to the first electrode.

11. The apparatus of claim 1, wherein the two or more electrodes include a first electrode comprising a linear trace that is located directly or indirectly on a first face of the semiconductor substrate and a second electrode comprising a linear trace that is located directly or indirectly on the first face of the semiconductor substrate and separated from the first electrode by a specified distance.

12. The apparatus of claim 11, wherein the specified distance is fixed.

13. The apparatus of claim 11, wherein the specified distance varies to form a tapered arrangement.

14. The apparatus of claim 11, comprising a ground plane located on an opposing second face of the semiconductor substrate at a specified distance from the first and second electrodes.

15. The apparatus of claim 1, in which the substrate includes multiple layers.

16. The apparatus of claim 1, in which the substrate includes multiple active layers.

17. The apparatus of claim 1, in which the electrodes are permanently formed at manufacture as being capacitively coupled to the active substrate, wherein the active substrate provides free charge carriers.

18. The apparatus of claim 1, wherein the heat source location is capable of being selected by adjusting the frequency of the time-varying electrical energy to correspond to a specified relative coplanar minimum spacing of the one or more electrodes along the length of the one or more electrodes to define the frequency-selected heat source location along the length of the one or more electrodes.

19. The apparatus of claim 1, wherein the one or more electrodes include a pair of electrodes defining a variable minimum interelectrode spacing therebetween at different locations along a length of the one or more electrodes to allow frequency-controlled selection of the heat source location along the length of the one or more electrodes.

20. A method of establishing or adjusting a temperature of a heating element, the method comprising:

obtaining or providing an article of manufacture comprising an active heat source including a predefined substrate and two or more electrodes, formed at manufacture to be located directly or indirectly on the substrate, wherein the two or more electrodes including first and second electrodes separated from each other by different minimum spacing at different locations on at least one of the first and second electrodes;

receiving, at the two or more electrodes, non-zero frequency time-varying electrical energy that is coupled by the two or more electrodes to the substrate to generate a frequency-controlled heat source in the substrate;

tuning a frequency of the time-varying electrical energy to generate frequency-controlled selection of location of heat in the substrate along a length of the two or more electrodes, the tuning including adjusting the frequency of the time-varying electrical energy for selectably adjusting at least one corresponding frequency-dependent current path between the first and second electrodes to provide the frequency-controlled heat at at least one desired location in the substrate; and

establishing or adjusting a temperature of the substrate, including controlling the frequency of the electrical energy received at the two or more electrodes.

21. The method of claim 20, comprising capacitively coupling the time-varying electrical energy from the two or more electrodes to the substrate.

22. The method of claim 20, comprising wirelessly receiving, at the two or more electrodes, time-varying electrical energy that includes a non-zero frequency that is at or exceeds at least one of a RF frequency or a microwave frequency.

23. The method of claim 20, comprising:

sensing a temperature associated with the substrate;

using information about the sensed temperature, establishing or adjusting at least one of (1) an amplitude of the time-varying electrical energy generated by the electric field signal generator;

(2) a frequency of the time-varying electrical energy generated by the electric field generator;

or (3) a location or distribution of a current path between the first and second electrodes.

24. The method of claim 20, wherein two or more electrodes include first and second electric field nodes that include, at a first location on the substrate, a spacing separating the first and second electrodes, wherein the spacing is specified to be less than or equal to a spacing capable of generating heat in the substrate, without requiring net charge flow into or out of the substrate via pass-through conduction current, in response to the time-varying electrical energy received at the first and second electrodes.

25. The method of claim 20, wherein the establishing or adjusting a temperature of the substrate, includes direct heating of the substrate by an electric field produced by the time-varying electrical energy, without requiring indirect heat coupling to the substrate.

26. The method of claim 20, comprising using temperature information to establish or adjust an amplitude of the time-varying electrical energy received by the two or more electrodes.

27. The method of claim 20, comprising using temperature information to establish or adjust a frequency of the time-varying electrical energy received by the two or more electrodes.

28. The method of claim 20, comprising using temperature information to control extracting heat from the substrate.