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Method of making a semiconductor switch device

  • US 10,431,666 B2
  • Filed: 03/26/2018
  • Issued: 10/01/2019
  • Est. Priority Date: 05/17/2017
  • Status: Active Grant
First Claim
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1. A method of making a semiconductor switch device, the method comprising:

  • providing a semiconductor substrate having;

    a major surface; and

    a first semiconductor region having a first conductivity type located adjacent the major surface;

    depositing a gate dielectric on the major surface of the substrate;

    implanting ions into the first semiconductor region through an opening in a mask positioned over the first semiconductor region, thereby to form a well region located in the first semiconductor region, the well region having a second conductivity type different to the first conductivity type;

    depositing and patterning a gate electrode material on the gate dielectric to form a gate electrode located directly above the well region; and

    performing ion implantation to;

    form a source region having said first conductivity type located in the well region on a first side of the gate electrode, andform a drain region having said first conductivity type located outside the well region on a second side of the gate electrode;

    wherein a lateral dimension of the opening in the mask is substantially equal to Lsource+Lg+MTL;

    wherein Lsource is a length of the source region measured from an edge of the gate electrode on the first side of the gate electrode;

    wherein Lg is a gate length of the semiconductor switch device; and

    wherein MTL is a mask tolerance of the opening, and wherein MTL≤

    400 nm.

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