Implantable sensor enclosure with thin sidewalls

• US 10,433,764 B2
• Filed: 12/11/2017
• Issued: 10/08/2019
• Est. Priority Date: 06/30/2011
• Status: Active Grant

• Current Assignee: Endotronix, Inc.
• Original Assignee: Endotronix, Inc.
• Inventors: Rowland, Harry, Nagy, Michael
• Primary Examiner(s): Bloch, Michael R
• Application Number:
  US15/837,075
• Publication Number:
  US 20180116552A1
• Time in Patent Office: 666 Days
• Field of Search: None
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/6861 Capsules, e.g. for swallowing or implanting

Abstract

A wireless circuit includes a housing, such as a hermetic housing, and at least one antenna coil wound about a coil axis within the housing. The coil axis may be substantially parallel to at least one wall of the housing, wherein the wall parallel to the coil axis is substantially thinner than other walls of the housing.

Claims

1. A wireless circuit for an implant comprising:

a housing including side walls defining a cuboid wherein said housing has length, width and height dimensions, and wherein the length is greater than the housing'"'"'s width and height dimensions, and wherein two opposite long sides of the housing are open;

at least one antenna coil wound about a coil axis and positioned within said housing;

thin walls bonded to the open sides of the housing; and

wherein said thin walls are thinner than the side walls of said housing and wherein said thin walls are configured to deform in proportion to pressure exerted on the thin walls.

2. The wireless circuit for an implant of claim 1, wherein said coil axis is substantially parallel to the thin walls of said housing and perpendicular to said length of said housing.

3. The wireless circuit of claim 1, further comprising a pressure sensor that is configured to measure pressure.

4. The wireless circuit of claim 1, wherein said thin walls further comprise a material selected from a group including:

sapphire, fused silica, quartz, glass, ceramic, titanium, alumina, silicon, diamond, and polymer.

5. The wireless circuit of claim 1, wherein said housing is bonded together by a process selected from a group including:

laser welding, glass frit bonding, laser frit welding, compression bonding, anodic bonding, eutectic bonding, brazing, or soldering.

6. The wireless circuit of claim 1 further comprising an electronics portion that serves as one of the thin walls of said housing.

7. The wireless circuit of claim 1 further comprising a thin film electronics device circuit is disposed on one of the walls of said housing.

8. The wireless circuit of claim 1, wherein said thin walls of said housing have a thickness less than about 0.025 mm, about 0.020 mm, about 0.015 mm, about 0.010 mm, about 0.005 mm, about 0.001 mm and any sized thickness in between.

9. The wireless circuit of claim 1, wherein the side walls of the housing are greater than 0.3 mm.