Thermal management for implantable wireless power transfer systems

• US 10,434,235 B2
• Filed: 01/27/2017
• Issued: 10/08/2019
• Est. Priority Date: 07/27/2012
• Status: Active Grant

• Current Assignee: TC1 LLC (Abbott Laboratories Incorporated)
• Original Assignee: TCI, LLC (Allient, Inc.)
• Inventors: Hansen, John Freddy, Stark, III, Joseph C.
• Primary Examiner(s): Koharski, Christopher
• Assistant Examiner(s): Bays, Pamela M.
• Application Number:
  US15/417,720
• Publication Number:
  US 20170136165A1
• Time in Patent Office: 984 Days
• Field of Search: 600 16
• CPC Class Codes: A61M 2205/3569 sublocal, e.g. between console and disposable
• CPC Class Codes: A61M 2205/3584 using modem, internet or bluetooth
• CPC Class Codes: A61M 2205/3606 cooled
• CPC Class Codes: A61M 2205/362 by gas flow
• CPC Class Codes: A61M 2205/8243 by induction
• CPC Class Codes: A61M 60/20 Type thereof
• CPC Class Codes: A61M 60/873 specially adapted for wireless or transcutaneous energy transfer [TET], e.g. inductive charging
• CPC Class Codes: A61N 1/3758 Packaging of the components within the casing
• CPC Class Codes: A61N 1/3787 from an external energy source
• CPC Class Codes: A61N 1/3968 Constructional arrangements, e.g. casings A61N1/375 takes precedence
• CPC Class Codes: H01F 38/14 Inductive couplings for wireless supply or distribution of electric power using inductive coupling H02J50/10
• CPC Class Codes: H02J 50/10 using inductive coupling
• CPC Class Codes: H05K 7/20272 Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
• CPC Class Codes: H05K 7/20327 Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00
• CPC Class Codes: H05K 7/20409 Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

Abstract

Thermal management solutions for wireless power transfer systems are provided, which may include any number of features. In one embodiment, an implantable wireless power receiver includes at least one thermal layer disposed on an interior surface of the receiver configured to conduct heat from a central portion of the receiver towards edges of the receiver. The thermal layer can comprise, for example, a copper layer or a ceramic layer embedded in an acrylic polymer matrix. In some embodiments, a plurality of thermal channels can be formed within the receiver to transport heat from central regions of the receiver towards edges of the receiver via free convection. In yet another embodiment, a fluid pipe can be connected to the receiver and be configured to carry heat from the receiver to a location remote from the receiver. Methods of use are also provided.

Claims

1. A power receiver of a wireless power transfer system, comprising:

an outer ferrite housing;

an inner titanium housing disposed within the outer ferrite housing;

a receiver coil supported by the outer ferrite housing;

a plurality of electronics disposed within the inner titanium housing and coupled to the receiver coil, the electronics configured to control wireless power transfer from an external power transmitter to the receiver coil;

a thermal medium disposed in the inner titanium housing, the thermal medium having a boiling point at a temperature greater than 38°

C. but less than 45°

C.; and

a pipe having a first end and a second end, the first end in flow communication with the thermal medium, the second end positioned at a location exterior to the outer ferrite housing, the pipe extending from the first end to the second end through the inner titanium housing and the outer ferrite housing, the pipe configured to carry a fluid or vapor generated by the thermal medium to the location exterior to the outer ferrite housing when the thermal medium surpasses its boiling point in response to heat generated in the outer ferrite housing.

2. The power receiver of claim 1 wherein the second end of the pipe is coupled to an implantable medical device.

3. The power receiver of claim 2 wherein the medical device comprises a blood pump.

4. The power receiver of claim 1 wherein heat from the fluid or vapor is rejected into a blood stream of a patient.

5. The power receiver of claim 1 wherein the vapor is allowed to condense at the location exterior to the outer ferrite housing to form droplets which can be pulled back towards the power receiver to absorb heat.

6. The power receiver of claim 1 wherein the pipe comprises a flexible tube.