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Bonding method and device

  • US 10,434,720 B2
  • Filed: 04/11/2016
  • Issued: 10/08/2019
  • Est. Priority Date: 10/22/2013
  • Status: Active Grant
First Claim
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1. A bonding method for bonding a pressing target portion of a gas barrier function film to a film-made pack by disposing the film-made pack and the gas barrier function film, which includes a sealing function layer having a lower toughness than the film-made pack between a set of pressurization molds comprising first and second pressurization molds, which each have frame shaped pressurization surfaces disposed so as to face each other and in which an opening hole is formed in the frame shaped pressurization surface of the first pressurization mold and an opening hole is formed in the frame shaped pressurization surface of the second pressurization mold, the method comprising:

  • bonding the pressing target portion to the film-made pack using the set of pressurization molds, wherein the first pressurization mold has a configuration in which a first edge on the opening hole side of the pressurization surface of the first pressurization mold faces the gas barrier function film and is positioned further inside the opening hole of the first pressurization mold than a second edge on the opening hole side of the pressurization surface of the second pressurization mold which faces the film-made pack,wherein the first edge of the first pressurization mold is chamfered,and the method further including positioning the film-made pack within the opening hole of the second pressurization mold.

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