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Method for producing a semiconductor module

  • US 10,435,292 B2
  • Filed: 07/17/2017
  • Issued: 10/08/2019
  • Est. Priority Date: 07/20/2016
  • Status: Active Grant
First Claim
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1. A method for producing a semiconductor module, the method comprising:

  • fabricating a semiconductor panel comprising a first mold compound having a plurality of semiconductor devices embedded therein, wherein for each semiconductor device, the first mold compound defines side walls that surround an inner space;

    fabricating a cap panel comprising a second mold compound that includes a plurality of caps, wherein each cap is defined by a cavity formed within the second mold compound;

    bonding the cap panel onto the semiconductor panel so that each one of the caps covers one or more of the semiconductor devices; and

    singulating the first mold compound and the second mold compound of the bonded panels into a plurality of semiconductor modules.

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