Plasma processing apparatus and plasma processing method

• US 10,438,819 B2
• Filed: 09/29/2017
• Issued: 10/08/2019
• Est. Priority Date: 05/18/2012
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Matsumoto, Naoki
• Primary Examiner(s): Olsen, Allan W.
• Application Number:
  US15/720,768
• Publication Number:
  US 20180025923A1
• Time in Patent Office: 739 Days
• Field of Search: None
• CPC Class Codes: C23C 16/405 of refractory metals or yttrium
• CPC Class Codes: C23C 16/511 using microwave discharges
• CPC Class Codes: H01J 37/32192 Microwave generated discharge H01J37/32357, H01J37/32366, H01J37/32394, H01J37/32403 take precedence
• CPC Class Codes: H01J 37/3222 Antennas
• CPC Class Codes: H01L 21/2636 for heating, e.g. electron beam heating
• CPC Class Codes: H01L 21/3065 Plasma etching; Reactive-ion etching
• CPC Class Codes: H01L 21/324 Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering H01L21/20 - H01L21/288 and H01L21/302 - H01L21/322 take precedence
• CPC Class Codes: H01L 21/67069 for drying etching
• CPC Class Codes: H05H 1/46 using applied electromagnetic fields, e.g. high frequency or microwave energy H05H1/26 takes precedence
• CPC Class Codes: H05H 1/463 using antennas or applicators

Abstract

A plasma processing apparatus includes: a processing container which defines a processing space; a microwave generator; a dielectric having an opposing surface which faces the processing space; a slot plate formed with a plurality of slots; and a heating member provided within the slot plate. The slot plate is provided on a surface of the dielectric at an opposite side to the opposing surface to radiate microwaves for plasma excitation to the processing space through the dielectric based on the microwaves generated by the microwave generator.

Claims

1. A method of performing a plasma processing by using a plasma processing apparatus, the method comprising:

providing a plasma processing apparatus including a processing container which defines a processing space;

a microwave generator;

a dielectric having an opposing surface which faces the processing space;

a slot plate formed with a plurality of slots and provided on a surface of the dielectric at an opposite side to the opposing surface to radiate microwaves for plasma excitation to the processing space through the dielectric based on the microwaves generated by the microwave generator; and

a heating member provided within the slot plate;

wherein the slot plate has a disk shape, wherein the plurality of slots includes;

(i) a first slot group formed by a plurality of pairs of elongated holes arranged along a circumferential direction of the slot plate, two elongated holes in each pair of elongated holes extending in crossing directions; and

(ii) a second slot group formed by a plurality of pairs of elongated holes arranged along the circumferential direction of the slot plate outside of the first slot group in a radial direction of the slot plate, two elongated holes in each pair of elongated holes extending in crossing directions; and

wherein the heating member includes at least one of;

(i) a first heater provided in a central region of the slot plate inside the first slot group in the radial direction;

(ii) a second heater provided in an intermediate region of the slot plate outside the first slot group in the radial direction, and inside the second slot group in the radial direction;

or (iii) a third heater provided in an outer periphery region of the slot plate outside the second slot group in the radial direction;

the method further comprising;

performing a heating processing using the slot plate and the heating member which includes at least one of (i), (ii) or (iii), before the plasma processing of irradiating the microwaves for plasma excitation to the processing space is performed;

performing the plasma processing after the heating processing is initiated; and

stopping the heating processing by the heating member.

2. The method of performing a plasma processing by using a plasma processing apparatus of claim 1, further including initiating the plasma processing when the heating processing has been performed for a predetermined time, or when the component temperature of the plasma processing apparatus reaches a predetermined temperature.

3. The method of performing a plasma processing by using a plasma processing apparatus of claim 2, wherein the dielectric is a dielectric window.

4. The method of performing a plasma processing by using a plasma processing apparatus of claim 1, further including stopping the heating processing by the heating member after the plasma processing is initiated.

5. The method of performing a plasma processing by using a plasma processing apparatus of claim 1, further including stopping the heating processing by the heating member before the plasma processing is initiated.

6. The method of performing a plasma processing by using a plasma processing apparatus of claim 1, further including providing the heating member within the slot plate and insulated with respect to the slot plate by an insulating material.

7. The method of performing a plasma processing by using a plasma processing apparatus of claim 1, wherein at least one of:

the first heater is spirally wound in the central region of the slot plate inside the first slot group in the radial direction;

the second heater is spirally wound in the intermediate region of the slot plate outside the first slot group in the radial direction, and inside the second slot group in the radial direction;

or

the third heater is spirally wound in the outer periphery region of the slot plate outside the second slot group in the radial direction.

8. The method of performing a plasma processing by using a plasma processing apparatus of claim 1, wherein a heat removal member is provided on a side wall of the processing container.

9. The method of performing a plasma processing by using a plasma processing apparatus of claim 8, wherein the heat removal member is beryllium copper or tungsten.

10. The method of performing a plasma processing by using a plasma processing apparatus of claim 1, wherein the processing apparatus further comprises a waveguide configured to guide the microwaves generated by the microwave generator to the slot plate, and

wherein a heat removal member is provided on the waveguide.