Power quad flat no-lead (PQFN) package in a single shunt inverter circuit
First Claim
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1. A power quad flat no-lead (PQFN) package comprising:
- a leadframe; and
a driver integrated circuit (IC) positioned to a driver IC die pad of the leadframe, wherein the driver IC comprises;
a first level shifter configured to output;
a first signal to a first gate driver to drive a first high-side power transistor of a bridge circuit of the PQFN package; and
a second signal to a second gate driver to drive a second high-side power transistor of a bridge circuit of the PQFN package, wherein the first high-side power transistor and the second high-side power transistor are situated on a top-side of a common die pad; and
a second level shifter configured to output;
a third signal to a third gate driver of the driver IC to drive a first low-side power transistor of the bridge circuit of the PQFN package,wherein a drain of the first low-side power transistor is situated on a first die pad, and the first die pad is electrically connected to a first leadframe strip comprising a first leadframe island, andwherein at least a portion of the first leadframe strip is exposed at an edge of the leadframe; and
a fourth signal to a fourth gate driver of the driver IC to drive a second low-side power transistor of the bridge circuit of the PQFN package,wherein a drain of the second low-side power transistor is situated on a second die pad, and the second die pad is electrically connected to a second leadframe strip comprising a second leadframe island, andwherein at least a portion of the second leadframe strip is exposed at the edge of the leadframe.
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Abstract
According to an exemplary implementation, a power quad flat no-lead (PQFN) package includes a driver integrated circuit (IC) situated on a leadframe. The PQFN package further includes low-side U-phase, low-side V-phase, and low-side W-phase power switches situated on the leadframe. A logic ground of the leadframe is coupled to a support logic circuit of the driver IC. A power stage ground of the leadframe is coupled to sources of the low-side U-phase, low-side V-phase, and low-side W-phase power switches. The power stage ground can further be coupled to gate drivers of the driver IC.
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Citations
18 Claims
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1. A power quad flat no-lead (PQFN) package comprising:
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a leadframe; and a driver integrated circuit (IC) positioned to a driver IC die pad of the leadframe, wherein the driver IC comprises; a first level shifter configured to output; a first signal to a first gate driver to drive a first high-side power transistor of a bridge circuit of the PQFN package; and a second signal to a second gate driver to drive a second high-side power transistor of a bridge circuit of the PQFN package, wherein the first high-side power transistor and the second high-side power transistor are situated on a top-side of a common die pad; and a second level shifter configured to output; a third signal to a third gate driver of the driver IC to drive a first low-side power transistor of the bridge circuit of the PQFN package, wherein a drain of the first low-side power transistor is situated on a first die pad, and the first die pad is electrically connected to a first leadframe strip comprising a first leadframe island, and wherein at least a portion of the first leadframe strip is exposed at an edge of the leadframe; and a fourth signal to a fourth gate driver of the driver IC to drive a second low-side power transistor of the bridge circuit of the PQFN package, wherein a drain of the second low-side power transistor is situated on a second die pad, and the second die pad is electrically connected to a second leadframe strip comprising a second leadframe island, and wherein at least a portion of the second leadframe strip is exposed at the edge of the leadframe. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A power quad flat no-lead (PQFN) package comprising:
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a leadframe; a common die pad; and a U-phase power switch, a V-phase power switch, a W-phase power switch, and a driver IC (Integrated Circuit) each positioned to the leadframe, wherein the U-phase power switch, the V-phase power switch, the W-phase power switch are each situated respectively on a first, second and third die pad different from the common die pad, wherein the driver IC comprises a first level shifter configured to; output a first signal to a first gate driver to drive the U-phase power switch, wherein the first die pad is electrically connected to a first leadframe strip comprising a first leadframe island; output a second signal to a second gate driver to drive the V-phase power switch, wherein the second die pad is electrically connected to a second leadframe strip comprising a second leadframe island; and output a third signal to a third gate driver to drive the W-phase power switch. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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Specification