Light emitter packages, systems, and methods having improved performance

• US 10,439,112 B2
• Filed: 07/20/2012
• Issued: 10/08/2019
• Est. Priority Date: 05/31/2012
• Status: Active Grant

• Current Assignee: Creeled Incorporated
• Original Assignee: CREE Incorporated (Wolfspeed, Inc.)
• Inventors: Clark, Joseph G., Britt, Jeffrey Carl, Abare, Amber C., Rosado, Raymond, Sundani, Harsh, Emerson, David T., Nevins, Jeremy Scott
• Primary Examiner(s): Bradley, Stephen M
• Application Number:
  US13/554,776
• Publication Number:
  US 20130322068A1
• Time in Patent Office: 2,636 Days
• Field of Search: 257 88, 257 92, 257 99
• CPC Class Codes: F21K 9/233 specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
• CPC Class Codes: F21V 21/00 Supporting, suspending, or attaching arrangements for lighting devices F21V17/00, F21V19/00 take precedence; arrangement of signalling or lighting devices, the mounting or supporting thereof or circuits therefor, for vehicles in general B60Q, stands for supporting apparatus or articles in general F16M11/00; Hand grips
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 7/00 Reflectors for light sources characterised by cooling arrangements F21V29/505
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/58 Optical field-shaping elements
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H01L 33/641 characterized by the materials
• CPC Class Codes: H01S 5/0231 Stems

Abstract

Light emitter packages, systems, and methods having improved performance are disclosed. In one aspect, a light emitter package can include a submount that can include an anode and a cathode. A light emitter chip can be disposed over the submount such that the light emitter chip is mounted over at least a portion of the cathode and wirebonded to at least a portion of the anode.

Claims

1. A light emitter package comprising:

a submount comprising a plurality of outer edges and a planar surface disposed between the outer edges;

multiple areas of exposed metal disposed over the planar surface of the submount, wherein the areas of exposed metal extend adjacent to the outer edges of the submount, but not beyond the outer edges of the submount;

a light emitter chip disposed over the submount;

a lens disposed over the submount, the lens comprising a lens base; and

a protective layer disposed around the lens base;

wherein the areas of exposed metal are disposed over substantially all of a portion of the submount that is outside of the lens base, below the protective layer, and around each side of the light emitter chip outside of the lens base for reflecting light therefrom,

wherein the protective layer contacts all of the areas of exposed metal that are around each side of the light emitter chip and outside the lens base,

wherein the areas of exposed metal are separated by a gap that is continuous between opposing side edges of the substrate,

wherein the gap is filled, at least partially, by solder mask material that is not disposed over the areas of exposed metal, and

wherein all of the areas of exposed metal are devoid of solder mask material so that the areas of exposed metal are reflective.

2. The light emitter package of claim 1, wherein the light emitter package is configured to deliver approximately 200 or more lumens per watt (LPW) at 350 mA.

3. The light emitter package of claim 1, wherein the multiple areas of exposed metal comprise an anode and a cathode.

4. The light emitter package of claim 3, wherein the solder mask material is at least partially disposed between the anode and the cathode.

5. The light emitter package of claim 3, wherein the light emitter chip is entirely disposed over the cathode.

6. The light emitter package of claim 1, wherein a discrete layer of optical conversion material is disposed directly over portions of the light emitter chip.

7. The light emitter package of claim 1, wherein the multiple areas of exposed metal comprise copper (Cu).

8. The light emitter package of claim 7, wherein the multiple areas of exposed metal comprise copper (Cu), silver (Ag), and Titanium (Ti).

9. The light emitter package of claim 1, wherein the lens base comprises a circular lens base.

10. The light emitter package of claim 1, wherein the lens base comprises a radius equal to or greater than approximately 1.53 mm.

11. The light emitter package of claim 1, wherein the lens base comprises a radius equal to or greater than approximately 2.25 mm.

12. The light emitter package of claim 1, wherein the lens base comprises a radius equal to or greater than approximately 3.75 mm.

13. The light emitter package of claim 1, wherein the submount comprises a length and width of approximately 3.45 mm.

14. The light emitter package of claim 1, wherein the submount comprises a length and width of approximately 7 mm.

15. The light emitter package of claim 1, wherein the submount comprises a length and width of approximately 9.1 mm.

16. The light emitter package of claim 1, wherein the light emitter chip comprises a surface area of at least 6 mm².

17. The light emitter package of claim 1, wherein the submount comprises a surface area of approximately 45 mm² or more.

18. The light emitter package of claim 9, wherein the lens base comprises an area of approximately 30 mm² or more.

19. The light emitter package of claim 1, wherein the submount comprises a thermal conductivity equal to or greater than approximately 30 watts per meter kelvin (W/m·

K).

20. The light emitter package of claim 9, wherein the circular lens base is disposed over the submount, wherein the submount comprises a rectangular shape, and wherein a length of the submount is equal to or greater than a diameter of the circular lens base.

21. The light emitter package of claim 1, wherein the light emitter package is ENERGY STAR®

compliant.

22. The light emitter package of claim 1, wherein the light emitter package is level 4 UL®

recognized.

23. A light emitter package comprising:

a submount comprising a planar surface;

a plurality of electrical components disposed over the planar surface of the submount, wherein the plurality of electrical components comprises at least a first electrical trace, a second electrical trace, and a light emitter chip, and wherein a gap is disposed between the first electrical trace and the second electrical trace;

a solder mask material disposed only in the gap;

a protective layer of silicone disposed over the submount; and

at least one discrete and continuous layer of phosphor that is disposed between the protective layer of silicone and the planar surface of the submount, wherein the layer of phosphor is disposed over multiple surfaces of each electrical component of the plurality of electrical components, and wherein surfaces of each electrical component that are facing the planar surface of the submount are devoid of the at least one layer of phosphor.

24. The light emitter package of claim 23, wherein the light emitter package is configured to deliver approximately 200 or more lumens per watt (LPW) at 350 mA.

25. The light emitter package of claim 23, wherein one or more of the at least one layer of phosphor is configured to emit blue, green, or red light.

26. The light emitter package of claim 23, wherein the solder mask material is white.

27. The light emitter package of claim 23, further comprising a lens formed over the protective layer.

28. The light emitter package of claim 27, wherein the lens comprises a circular lens base.

29. The light emitter package of claim 28, wherein the circular lens base is disposed over the submount, wherein the submount comprises a rectangular shape, and wherein a length of the submount is equal to or greater than a diameter of the circular lens base.

30. The light emitter package of claim 23, wherein the light emitter chip comprises a surface area of at least 6 mm².

31. The light emitter package of claim 23, wherein the submount comprises a surface area of approximately 45 mm² or more.

32. The light emitter package of claim 28, wherein the lens base comprises an area of approximately 30 mm² or more.

33. The light emitter package of claim 23, wherein the submount comprises a thermal conductivity equal to or greater than approximately 30 watts per meter kelvin (W/m·

K).

34. The light emitter package of claim 23, wherein the first and second traces comprise silver.

35. The light emitter package of claim 23, wherein the first and second traces comprise copper.

36. The light emitter package of claim 23, wherein the light emitter package is ENERGY STAR®

compliant.

37. The light emitter package of claim 23, wherein the light emitter chip is entirely disposed over either the first electrical trace or the second electrical trace.