Frequency compensated oscillator design for process tolerances

• US 10,439,579 B2
• Filed: 04/30/2018
• Issued: 10/08/2019
• Est. Priority Date: 10/03/2003
• Status: Active Grant

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Lutz, Markus, Partridge, Aaron
• Primary Examiner(s): Gannon, Levi
• Application Number:
  US15/966,644
• Publication Number:
  US 20180248532A1
• Time in Patent Office: 526 Days
• Field of Search: 331154, 331156
• CPC Class Codes: H03H 2009/02299 Comb-like, i.e. the beam comprising a plurality of fingers or protrusions along its length
• CPC Class Codes: H03H 2009/0233 comprising perforations
• CPC Class Codes: H03H 2009/02496 Horizontal, i.e. parallel to the substrate plane
• CPC Class Codes: H03H 3/0072 of microelectro-mechanical resonators or networks micromembranes or microbeams B81B2203/01; manufacture of microstructural devices in general B81C
• CPC Class Codes: H03H 3/0076 for obtaining desired frequency or temperature coefficients
• CPC Class Codes: H03H 3/0077 by tuning of resonance frequency
• CPC Class Codes: H03H 9/2447 Beam resonators H03H9/2468 takes precedence
• CPC Class Codes: H03H 9/2457 Clamped-free beam resonators
• CPC Class Codes: H03H 9/2463 Clamped-clamped beam resonators
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making

Abstract

A continuous or distributed resonator geometry is defined such that the fabrication process used to form a spring mechanism also forms an effective mass of the resonator structure. Proportional design of the spring mechanism and/or mass element geometries in relation to the fabrication process allows for compensation of process-tolerance-induced fabrication variances. As a result, a resonator having increased frequency accuracy is achieved.

Claims

1. A resonator comprising:

a substrate;

an anchor;

a mass element having an effective mass m; and

a spring beam;

wherein;

the spring beam is movably suspended over the substrate;

a first end of the spring beam is attached to the anchor, which anchors the spring beam, at the first end, to the substrate;

a second end of the spring beam is attached to the mass element;

the spring beam has an actual width that is defined by a process used to form the spring beam from a first constituent material and to form the mass element;

an effective mechanical stiffness k_y that defines a limitation on the movability of the spring beam is defined as

2. The resonator of claim 1, wherein the actual width results from a design width and a total deviation from the design width due to imperfections in the process.

3. The resonator of claim 2, wherein:

the total deviation is defined by a nominal undercut and a tolerance of undercut; and

the nominal undercut is accounted for in a design procedure defining the design width.

4. The resonator of claim 3, wherein the net effect of the tolerance of undercut associated with the process, as applied proportionally to the actual width of the spring beam and the effective mass of the mass element, results in little change to the ratio defined by a change in the effective mechanical stiffness and a change in the effective mass.

5. The resonator of claim 1, wherein the spring beam and the mass element are formed from the same constituent material.

6. The resonator of claim 1, wherein the process includes at least one etch step selected from a group of etch steps including wet etch, plasma etch, and vapor etch.

7. The resonator of claim 1, wherein a first side of the mass element is attached to the spring beam, which is anchored to the substrate via the anchor, and a second side of the mass element, opposite the first side, is not attached to the spring beam and is not separately anchored to the substrate.

8. The resonator of claim 1, wherein the plurality of beams of the mass element are uniformly formed with widths that are ⅓

of the actual width of the spring beam.

9. The resonator of claim 1, wherein the mass element is formed of a second constituent material that is different than the first constituent material.

10. The resonator of claim 9, wherein the process includes etching the first and second constituent materials, and the first and second constituent materials are such that an etch rate at which the second constituent material is etched by the etching is higher than an etch rate at which the first constituent material is etched by the etching.

11. The resonator of claim 1, wherein the process is lithography.

12. The resonator of claim 1, wherein the process is surface micro-machining.

13. The resonator of claim 1, wherein the process is wet etching.

14. The resonator of claim 1, wherein the process is dry etching.

15. The resonator of claim 1, wherein the process is plasma etching.

16. The resonator of claim 1, wherein the process is vapor etching.

17. The resonator of claim 1, wherein the mass element includes two opposite sides that each extends in a direction parallel to a longitudinal extension of the spring beam and that each is straight without any indentations.

18. The resonator of claim 1, wherein a first end of the mass element is attached to the substrate via the attachment of the spring beam to the mass element and the attachment of the spring beam to the anchor, and a second end of the mass element that is opposite to the first end is a free end that floats above the substrate without being attached to the substrate independently of the attachment of the first end of the mass element.