Microelectronic devices designed with high frequency communication modules having steerable beamforming capability
First Claim
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1. A communication module comprising:
- a die having a transceiver, wherein the die is a silicon based die;
a phase shifter die coupled to the die, the phase shifter die having a power combiner and splitter, wherein the phase shifter die is a compound semiconductor based die; and
a substrate coupled to the phase shifter die, the substrate having an antenna unit with steerable beam forming capability for transmitting and receiving communications.
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Abstract
Embodiments of the invention include a communication module that includes a die having a transceiver and a phase shifter die that is coupled to the die. The phase shifter includes a power combiner and splitter. The communication module also includes a substrate that is coupled to the phase shifter die. The substrate includes an antenna unit with steerable beam forming capability for transmitting and receiving communications.
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Citations
20 Claims
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1. A communication module comprising:
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a die having a transceiver, wherein the die is a silicon based die; a phase shifter die coupled to the die, the phase shifter die having a power combiner and splitter, wherein the phase shifter die is a compound semiconductor based die; and a substrate coupled to the phase shifter die, the substrate having an antenna unit with steerable beam forming capability for transmitting and receiving communications. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A microelectronic device comprising:
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a first die having a first portion of a transceiver, wherein the first die is a silicon based die; a second die having a second portion of the transceiver; a third die coupled to the second die, the third die having a power combiner and splitter, wherein the third die is a compound semiconductor based die; and a substrate coupled to the third die, the substrate having an antenna unit with steerable beam forming capability for transmitting and receiving communications. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16)
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17. A computing device comprising:
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at least one processor to process data; and a communication module or chip coupled to the at least one processor, the communication module or chip comprises, a first die having driver circuitry of a transceiver, wherein the first die is a silicon based die; a second die having amplifier circuitry of the transceiver, wherein the second die is a compound semiconductor based die; an integrated passive device (IPD) coupled to the second die, the IPD having a power combiner and splitter; and a substrate coupled to the IPD, the substrate having an antenna unit with steerable beam forming capability for transmitting and receiving communications. - View Dependent Claims (18, 19, 20)
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Specification