Flexible and stretchable electronic systems for epidermal electronics

• US 10,441,185 B2
• Filed: 06/08/2012
• Issued: 10/15/2019
• Est. Priority Date: 12/16/2009
• Status: Active Grant

• Current Assignee: Board of Trustees of The University of Illinois
• Original Assignee: Board of Trustees of The University of Illinois
• Inventors: Rogers, John A., Kim, Dae-Hyeong
• Primary Examiner(s): Jang, Christian
• Assistant Examiner(s): Toth, Karen E
• Application Number:
  US13/492,636
• Publication Number:
  US 20130041235A1
• Time in Patent Office: 2,685 Days
• CPC Class Codes: A61B 2562/02 Details of sensors specially adapted for in-vivo measurements
• CPC Class Codes: A61B 2562/0261 Strain gauges
• CPC Class Codes: A61B 2562/0271 Thermal or temperature sensors
• CPC Class Codes: A61B 2562/029 Humidity sensors
• CPC Class Codes: A61B 2562/046 in a matrix array
• CPC Class Codes: A61B 2562/066 in a matrix array
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 2562/164 the sensor is mounted in or on a conformable substrate or carrier
• CPC Class Codes: A61B 5/0537 Measuring body composition by impedance, e.g. tissue hydration or fat content
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/1104 induced by stimuli or drugs; A61B5/1102 takes precedence; investigating medicinal preparations G01N33/15
• CPC Class Codes: A61B 5/1107 Measuring contraction of parts of the body, e.g. organ, muscle apparatus for measuring work or force in general G01L
• CPC Class Codes: A61B 5/282 Holders for multiple electrodes for introduction into the body A61B5/287
• CPC Class Codes: A61B 5/287 Holders for multiple electrodes, e.g. electrode catheters for electrophysiological study [EPS]
• CPC Class Codes: A61B 5/291 for electroencephalography [EEG]
• CPC Class Codes: A61B 5/296 for electromyography [EMG]
• CPC Class Codes: A61B 5/302 for capacitive or ionised electrodes, e.g. metal-oxide-semiconductor field-effect transistors [MOSFET]
• CPC Class Codes: A61B 5/4875 Hydration status, fluid retention of the body
• CPC Class Codes: A61B 5/6867 specially adapted to be attached or implanted in a specific body part A61B5/6847 takes precedence
• CPC Class Codes: A61N 1/0472 Structure-related aspects
• CPC Class Codes: A61N 1/05 : for implantation or insertion into the body, e.g. heart electrode A61N1/06 takes precedence
• CPC Class Codes: A61N 1/0587 : Epicardial electrode systems; Endocardial electrodes piercing the pericardium
• CPC Class Codes: A61N 1/36 : for stimulation
• CPC Class Codes: H01L 23/3121 : a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3192 : Multilayer coating
• CPC Class Codes: H01L 27/1218 : with a particular composition or structure of the substrate
• CPC Class Codes: H01L 29/78603 : characterised by the insulating substrate or support H01L29/78657 takes precedence
• CPC Class Codes: H01L 29/7869 : having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 : Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H05K 1/0283 : Stretchable printed circuits
• CPC Class Codes: H05K 1/147 : at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence
• CPC Class Codes: H05K 1/189 : characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/09263 : Meander
• CPC Class Codes: H05K 3/323 : by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

Provided herein are skin-mounted biomedical devices and methods of making and using biomedical devices for sensing and actuation applications. For example, flexible and/or stretchable biomedical devices are provided, including electronic devices useful for establishing conformal contact with the skin of a subject. Devices disclosed herein can comprise a plurality of sensing and/or actuating devices provided as part of a skin-mounted flexible or stretchable electronic circuit.

Claims

1. A device for establishing an interface with a skin of a subject, the device comprising:

a flexible substrate having an effective Young'"'"'s modulus less than or equal to 10 MPa;

a flexible electronic circuit supported by the flexible substrate, wherein the flexible electronic circuit comprises a plurality of electrophysiological sensors provided in an array;

wherein each of said electrophysiological sensors independently comprises an inorganic thin film layer, an electrode thin film layer or a combination of these;

including one or more inorganic semiconductor circuit elements or electrodes, or a combination of inorganic semiconductor circuit elements and electrodes, wherein the plurality of electrophysiological sensors are connected with filamentary serpentine wires; and

a barrier layer encapsulating at least a portion of the flexible electronic circuit;

wherein said barrier layer is a multilayer structure comprising a plurality of polymer layers;

wherein said barrier layer provides an electrical, physical, chemical, and thermal barrier;

said device having a multilayer geometry wherein said flexible substrate, said flexible electronic circuit and said barrier layer are provided as a series of stacked layers wherein said flexible electronic circuit is provided between said flexible substrate and said barrier layer;

wherein the flexible substrate, barrier layer and the electronic circuit provide a net bending stiffness less than or equal to 1×

10⁸ GPa μ

m⁴ so as to allow for conformal contact to be established with the skin of the subject.

2. The device of claim 1, wherein the device is a skin mountable tissue sensor, a skin mountable tissue actuator, or an array of skin mountable tissue sensors or skin mountable tissue actuators.

3. The device of claim 1, wherein the device does not include an adhesive layer between the skin of the subject and the flexible electronic circuit.

4. The device of claim 1, wherein the device has an effective Young'"'"'s modulus and a thickness within a factor of 2 of a modulus and a thickness of an epidermal layer of the skin of the subject at the interface during use.

5. The device of claim 1, wherein the device has an effective Young'"'"'s modulus less than or equal to 500 kPa.

6. The device of claim 1, wherein the device has an effective Young'"'"'s modulus equal to or less than 50 times an effective Young'"'"'s modulus of the skin of the subject at the interface during use.

7. The device of claim 1, wherein the device has an average thickness less than or equal to 500 microns.

8. The device of claim 1, wherein the device has a net bending stiffness that is less than or equal to 1 nN m.

9. The device of claim 1, wherein the device has an areal mass density less than or equal to 10 mg cm⁻

2.

10. The device of claim 1, wherein the flexible substrate is a low modulus polymer.

11. The device of claim 1, wherein the flexible substrate effective Young'"'"'s modulus is less than or equal to 500 kPa.

12. The device of claim 1, wherein the flexible substrate is a low modulus rubber material or a low modulus silicone material.

13. The device of claim 1, wherein the flexible substrate is a bioinert or biocompatible material.

14. The device of claim 1, wherein the flexible substrate comprises a gas-permeable elastomeric sheet.

15. The device of claim 1, wherein the flexible electronic circuit comprises one or more electrodes transistors, inducers, LEDs, capacitors, oscillators, photodiodes, diodes or any combinations of these.

16. The device of claim 1, wherein the flexible electronic circuit comprises one or more amplifiers, strain gauges, temperature sensors, wireless power coils, solar cells, inductive coils, high frequency inductors, high frequency capacitors, high frequency oscillators, high frequency antennae, multiplex circuits, electrocardiography sensors, electromyography sensors, electroencephalography sensors, electrophysiological sensors, thermistors, transistors, diodes, resistors, capacitive sensors, light emitting diodes, or any combinations of these.

17. The device of claim 1, wherein the flexible electronic circuit has an average thickness less than or equal to 100 microns.

18. The device of claim 1, wherein the flexible electronic circuit comprises one or more single crystalline inorganic semiconductor structures.

19. The device of claim 1, wherein the flexible electronic circuit is positioned within 10 μ

m of a neutral mechanical plane of the device.

20. The device of claim 1, wherein the flexible electronic circuit comprises a plurality of stretchable electronic devices or device components.

21. The device of claim 20, wherein the flexible electronic circuit comprises one or more electronic devices or device components having a curved, serpentine, bent, wavy or buckled geometry.

22. The device of claim 21, wherein the flexible electronic circuit comprises one or more electronic devices or device components comprising structures having a curved geometry, wherein the one or more electronic devices or device components exhibit one or more curves positioned within a plane parallel to a receiving surface of the flexible substrate supporting the flexible electronic circuit.

23. The device of claim 21, wherein the flexible electronic circuit comprises one or more electronic devices or device components having the wavy geometry comprising structures characterized by a plurality of maxima and minima, wherein the maxima and minima are positioned within a plane parallel to a receiving surface of the flexible substrate supporting the flexible electronic circuit.

24. The device of claim 21, wherein the flexible electronic circuit comprises one or more nanoribbons, micromembranes or nanomembranes.

25. The device of claim 24, wherein the nanoribbons, micromembranes or nanomembranes are provided in a wavy geometry characterized by a plurality of maxima and minima.

26. The device of claim 25, wherein adjacent maxima and minima of the wavy geometry are separated by a distance less than or equal to 10 microns.

27. The device of claim 25, wherein the wavy geometry is characterized by a periodic structure.

28. The device of claim 25, wherein the wavy geometry is characterized by an amplitude of less than 10 microns.

29. The device of claim 25, wherein the wavy geometry is characterized by a radius of curvature less than or equal to 1 mm.

30. The device of claim 25, wherein the wavy geometry is a serpentine geometry.

31. The device of claim 30, wherein the serpentine geometry is characterized by a repeating s-shaped feature.

32. The device of claim 24, wherein local displacement of the nanoribbons, micromembranes or nanomembranes within a plane parallel to the receiving surface of the flexible substrate supporting the flexible electronic circuit reduces an overall state of strain of the device.

33. The device of claim 24, wherein the nanoribbons, micromembranes or nanomembranes comprise metallic structures, single crystalline semiconductor structures, or hybrid structures comprising one or more metallic structures connected to one or more single crystalline semiconductor structures.

34. The device of claim 1, wherein the flexible electronic circuit comprises one or more island and bridge structures.

35. The device of claim 34, wherein the island structures comprise one or more semiconductor circuit elements.

36. The device of claim 34, wherein the bridge structures comprise one or more flexible electrical interconnections.

37. The device of claim 1, wherein the flexible electronic circuit is assembled on the flexible substrate via contact printing.

38. The device of claim 1, further comprising a transfer substrate supporting the flexible substrate, the flexible electronic circuit, or both the flexible substrate and the flexible electronic circuit.

39. The device of claim 38, wherein the transfer substrate is in physical contact with the flexible substrate.

40. The device of claim 38, wherein the transfer substrate is a removable substrate and wherein the transfer substrate is configured to be partially or completely removed upon providing the device in contact with the skin of the subject or a dissolvable substrate and wherein the transfer substrate is configured to be partially or completely dissolved after the device is provided in contact with the skin of the subject.

41. The device of claim 38, wherein the transfer substrate is a polymer or polyvinyl acetate.

42. The device of claim 1, wherein the flexible substrate, the electronic circuit and the barrier layer provide a net flexural rigidity of the device less than or equal to 1×

10<sup>−

4</sup> N m.

43. The device of claim 1, wherein the barrier layer further comprises a material selected from the group consisting of:

an inorganic polymer, an organic polymer, an elastomer, a biopolymer, a ceramic, and any combination of these.

44. The device of claim 1, wherein the barrier layer comprises an elastomer.

45. The device of claim 1, wherein the barrier layer comprises PDMS, polyimide, SU-8, parylene, parylene C, silicon carbide (SiC), or Si₃N₄.

46. The device of claim 1, wherein the barrier layer is a biocompatible material or a bioinert material.

47. The device of claim 1 that is a hydration sensor, wherein the flexible electronic circuit comprises a plurality of electrodes for determining impedance of underlying skin of a subject.

48. The device of claim 47, wherein the plurality of electrodes is selected from the group consisting of:

meander electrodes;

interdigitated electrodes, circular electrodes and annular electrodes.

49. The device of claim 47, further comprising sensing electrodes configured to be in contact with skin and reference electrodes embedded in said flexible substrate.

50. The device of claim 47, wherein said hydration sensor maps hydration level over a surface area, maps hydration level as a function of depth from skin surface, or maps hydration level over both a surface area and depth.

51. The device of claim 50, wherein said hydration level map is generated for a depth that is up to about 60 to 100 micrometers from the skin surface.

52. The device of claim 1, wherein the flexible substrate, the barrier layer and the electronic circuit provide said net bending stiffness, an average thickness, an effective Young'"'"'s modulus, and an areal mass density that are matched to the epidermal layer during use.

53. The device of claim 1, wherein the flexible substrate, barrier layer and the electronic circuit provide a net bending stiffness less than 1 nN m, average thickness less than or equal to 500 microns, average Young'"'"'s modulus less 150 kPa, and areal mass density less than 3.8 mg cm⁻

2.

54. The device of claim 1, wherein said substrate is additionally stretchable.

55. The device of claim 1, wherein said electronic circuit is additionally stretchable.

56. The device of claim 1, wherein said substrate is stretchable and said electronic circuit is additionally stretchable.

57. The device of claim 1, wherein said barrier layer has a thermal conductivity of 0.3 W/m·

K or less.

58. The device of claim 1, wherein said barrier layer limits leakage current from the electronic device to the tissue to amount equal to or less than 0.1 μ

A/cm².