Coupling mechanism, substrate polishing apparatus, method of determining position of rotational center of coupling mechanism, program of determining position of rotational center of coupling mechanism, method of determining maximum pressing load of rotating body, and program of determining maximum pressing load of rotating body

  • US 10,442,054 B2
  • Filed: 11/16/2017
  • Issued: 10/15/2019
  • Est. Priority Date: 01/30/2015
  • Status: Active Grant
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