Manufacturing method of bonded-substrate article, manufacturing method of liquid discharge head, bonded-substrate article, and liquid discharge head

• US 10,442,202 B2
• Filed: 06/04/2018
• Issued: 10/15/2019
• Est. Priority Date: 06/09/2017
• Status: Active Grant

• Current Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Original Assignee: Canon Kabushiki Kaisha (Canon Inc.)
• Inventors: Fukumoto, Yoshiyuki
• Primary Examiner(s): Do, An H
• Application Number:
  US15/997,366
• Publication Number:
  US 20180354267A1
• Time in Patent Office: 498 Days
• Field of Search: 347 20, 347 44, 216 20, 216 33- 35
• CPC Class Codes: B41J 2/14032 Structure of the pressure chamber
• CPC Class Codes: B41J 2/14233 of film type, deformed by bending and disposed on a diaphragm
• CPC Class Codes: B41J 2/1603 of the front shooter type
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1629 wet etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1645 thin film formation by spincoating
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2202/12 with ink circulating through the whole print head

Abstract

A manufacturing method for a bonded-substrate article includes a first bonding where a first bonding region of a first substrate and a third bonding region of a second substrate are bonded at a first temperature, and a second bonding, following the first bonding, where a second bonding region of the first substrate and a fourth bonding region of the second substrate are bonded at a second temperature. The first temperature is lower than the second temperature.

Claims

1. A manufacturing method for a bonded-substrate article where a first substrate has a first bonding region and a second bonding region that are both bonded to a second substrate, and the second substrate has a third bonding region and a fourth bonding region that are both bonded to the first substrate, the method comprising:

first bonding, where the first bonding region of the first substrate and the third bonding region of the second substrate are bonded at a first temperature; and

second bonding, following the first bonding, where the second bonding region of the first substrate and the fourth bonding region of the second substrate are bonded at a second temperature,

wherein the first temperature is lower than the second temperature.

2. The manufacturing method of a bonded-substrate article according to claim 1, further comprising:

coating an adhesive agent onto at least one of the second bonding region of the first substrate and the fourth bonding region of the second substrate,

wherein the adhesive agent is hardened in the second bonding.

3. The manufacturing method of a bonded-substrate article according to claim 2,

wherein the first substrate has a step between a face that forms the first bonding region and a face that forms the second bonding region, the second substrate has a step between a face that forms the third bonding region and a face that forms the fourth bonding region, and the first substrate and second substrate are fit to each other at the steps of each other.

4. The manufacturing method of a bonded-substrate article according to claim 3,

wherein the face forming the second bonding region of the first substrate is at a position protruding further than the face forming the first bonding region, along a direction in which the first substrate and the second substrate are bonded,

wherein the face forming the fourth bonding region of the second substrate is at a position further recessed than the face forming the third bonding region, along the direction in which the first substrate and the second substrate are bonded,

and wherein the adhesive agent that is hardened in the second bonding is coated on the second bonding region.

5. The manufacturing method of a bonded-substrate article according to claim 1,

wherein, in the first bonding, the first bonding region of the first substrate and the third bonding region of the second substrate are bonded by direct bonding.

6. The manufacturing method of a bonded-substrate article according to claim 5,

wherein the direct bonding is plasma activated bonding or room-temperature bonding.

7. The manufacturing method of a bonded-substrate article according to claim 1, further comprising:

coating the adhesive agent on at least one of the first bonding region of the first substrate and the third bonding region of the second substrate,

and wherein the adhesive agent is hardened in the first bonding.

8. The manufacturing method of a bonded-substrate article according to claim 1,

wherein the second bonding is performed at a temperature of 100°

C. or higher.

9. The manufacturing method of a bonded-substrate article according to claim 1,

wherein the first bonding is performed at a temperature of 200°

C. or lower.

10. A manufacturing method for a liquid discharge head having a bonded-substrate article where a first substrate has a first bonding region and a second bonding region that are both bonded to a second substrate, and the second substrate has a third bonding region and a fourth bonding region that are both bonded to the first substrate, and the bonded-substrate article has a liquid channel traversing the first substrate and the second substrate, the method comprising:

first bonding, where the first bonding region of the first substrate and the third bonding region of the second substrate are bonded at a first temperature; and

second bonding, following the first bonding, where the second bonding region of the first substrate and the fourth bonding region of the second substrate are bonded at a second temperature,

wherein the first temperature is lower than the second temperature.

11. The manufacturing method of a liquid discharge head according to claim 10, further comprising:

coating an adhesive agent onto at least one of the second bonding region of the first substrate and the fourth bonding region of the second substrate,

wherein the adhesive agent is hardened in the second bonding.

12. The manufacturing method of a liquid discharge head according to claim 11,

wherein the first substrate has a step between a face that forms the first bonding region and a face that forms the second bonding region, the second substrate has a step between a face that forms the third bonding region and a face that forms the fourth bonding region, and the first substrate and second substrate are fit to each other via the steps of each other.

13. The manufacturing method of a liquid discharge head according to claim 12,

wherein the face forming the second bonding region of the first substrate is at a position protruding further than the face forming the first bonding region, along a direction in which the first substrate and the second substrate are bonded,

wherein the face forming the fourth bonding region of the second substrate is at a position further recessed than the face forming the third bonding region, along the direction in which the first substrate and the second substrate are bonded,

and wherein the adhesive agent that is hardened in the second bonding is coated on the third bonding region.

14. The manufacturing method of a liquid discharge head according to claim 10,

wherein the first bonding region and second bonding region of the first substrate are provided in order in a direction from an inner wall traversing the first substrate and second substrate toward an inner portion of the bonded-substrate article.

15. The manufacturing method of a liquid discharge head according to claim 10,

wherein, in the first bonding, the first bonding region of the first substrate and the third bonding region of the second substrate are bonded by direct bonding.

16. The manufacturing method of a liquid discharge head according to claim 15,

wherein the direct bonding is plasma activated bonding or room-temperature bonding.

17. A bonded-substrate article, comprising:

a first substrate;

a second substrate;

wherein the first substrate has a first bonding region and a second bonding region that are both bonded to the second substrate, and

the second substrate has a third bonding region and a fourth bonding region that are both bonded to the first substrate, and,

wherein the first bonding region of the first substrate and the third bonding region of the second substrate are directly in contact with each other to form a direct bonding region, and

the second bonding region of the first substrate and the fourth bonding region of the second substrate are bonded to each other, with an adhesive applied therebetween, to form an adhesive bonding region.

18. The bonded-substrate article according to claim 17, wherein the first substrate has a step between a face that forms the first bonding region and a face that forms the second bonding region, the second substrate has a step between a face that forms the third bonding region and a face that forms the fourth bonding region, and the step of the first substrate and the step of the second substrate are fit to each other.

19. A liquid discharge head, comprising:

a discharge orifice forming member that includes a discharge orifice,

a bonded-substrate article where a first substrate and a second substrate are bonded to each other, and the bonded-substrate article has a liquid channel provided traversing the first substrate and the second substrate, and

a side wall that connects the discharge orifice forming member to the bonded-substrate article,

wherein the bonded-substrate article is the bonded-substrate article according to claim 17.

20. The liquid discharge head according to claim 19,

wherein the first bonding region and second bonding region of the first substrate are provided in order in a direction from an inner wall of the channel traversing the first substrate and second substrate toward an inner portion of the bonded-substrate article.