Corrugated package for microelectromechanical system (MEMS) device
First Claim
1. A microelectromechanical system (MEMS) device package comprising:
- a substrate having a first surface and second surface;
a cover having an inner region and an outer region, the cover is coupled to the substrate and defines a cavity between the inner region and the substrate;
at least one device disposed within the cavity; and
an acoustic port defined in one of the substrate and the cover and connecting the cavity to an external environment,wherein a corrugated structure is formed on at least one of the inner region and the outer region.
1 Assignment
0 Petitions
Accused Products
Abstract
A MEMS device package assembly for encapsulating one or more internal components includes a first MEMS device package. The first package includes a cover and a substrate attached to the cover by any suitable methods of attachment. A corrugated structure is formed on at least one of an inner or outer wall of the cover. The assembly further includes a second MEMS device package having a cover, a substrate, and a corrugated structured formed on at least one of an inner or outer wall of the cover. The first and second MEMS device packages may be coupled to the same substrate or different substrate. In another embodiment, the first MEMS device package may be mounted on the second MEMS device package. In yet another embodiment, the first MEMS device package may be contained in the second MEMS device package.
15 Citations
22 Claims
-
1. A microelectromechanical system (MEMS) device package comprising:
-
a substrate having a first surface and second surface; a cover having an inner region and an outer region, the cover is coupled to the substrate and defines a cavity between the inner region and the substrate; at least one device disposed within the cavity; and an acoustic port defined in one of the substrate and the cover and connecting the cavity to an external environment, wherein a corrugated structure is formed on at least one of the inner region and the outer region. - View Dependent Claims (2, 4, 5, 6, 8, 9, 10, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
-
-
3. A microelectromechanical system (MEMS) device package comprising:
-
a substrate having a first surface and second surface; a cover having an inner region and an outer region, the cover is coupled to the substrate and defines a cavity between the inner region and the substrate; and at least one device disposed within the cavity, wherein the outer region comprises an outer wall, and the outer wall includes a corrugated structure. - View Dependent Claims (7, 11)
-
Specification