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Corrugated package for microelectromechanical system (MEMS) device

  • US 10,442,683 B2
  • Filed: 04/14/2016
  • Issued: 10/15/2019
  • Est. Priority Date: 04/14/2016
  • Status: Active Grant
First Claim
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1. A microelectromechanical system (MEMS) device package comprising:

  • a substrate having a first surface and second surface;

    a cover having an inner region and an outer region, the cover is coupled to the substrate and defines a cavity between the inner region and the substrate;

    at least one device disposed within the cavity; and

    an acoustic port defined in one of the substrate and the cover and connecting the cavity to an external environment,wherein a corrugated structure is formed on at least one of the inner region and the outer region.

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